Carrier for testing an unpackaged semiconductor die

A carrier for testing an unpackaged semiconductor die, comprising:

• a laminated carrier base adapted to retain the die, said carrier base formed of layers of a ceramic material bonded together, said carrier base formed with an opening;
• a plurality of external contacts formed on the carrier base and adapted for electrical connection to external test circuitry;
• a pattern of electrically conductive lines formed within the carrier base in electrical communication with the external contacts, said conductive lines terminating in a plurality of exposed metal plated pads;
• a plurality of metal filled vias for interconnecting the electrically conductive lines to the external contacts;
• an interconnect mountable to the base, said interconnect comprising a substrate having a pattern of raised contact members adapted to contact a corresponding pattern of contact locations on the die, said interconnect further comprising a pattern of electrically conductive traces in electrical communication with the raised contact members;
• means for establishing electrical communication between the metal plated pads on the conductive lines and the conductive traces on the interconnect;
• and
• a force distribution mechanism for biasing the interconnect and die together, said force distribution mechanism including a pressure plate for abutting the die, a bridge clamp clipped to the opening in the base and a spring sandwiched between the pressure plate and bridge clamp for exerting a biasing force on the pressure plate.

A carrier for testing an unpackaged semiconductor die, comprising:

• a carrier base adapted to retain the die, said carrier base formed of layers of a ceramic material bonded together, said carrier base including a pair of openings;
• a plurality of external contacts formed on an upper surface and a lower surface of the carrier base in matched pairs, said external contacts adapted for electrical connection to external test circuitry;
• a plurality of metal plated pads formed around a periphery of the recess and in electrical communication with electrically conductive lines formed on a layer of the carrier base;
• a plurality of metal filled vias formed through adjacent layers of the carrier base for interconnecting the electrically conductive lines to the external contacts;
• an interconnect mountable to the base, said interconnect comprising a substrate having a pattern of raised contact members adapted to form an ohmic contact with contact locations on the die, said interconnect further comprising a pattern of electrically conductive traces in electrical communication with said raised contact members;
• means for establishing electrical communication between the metal plated pads on the carrier base and the conductive traces on the interconnect;
• and
• a force distribution mechanism clipped to the pair of openings in the base for biasing the interconnect and die together.