G01R 31/2898
Sample preparation
Official title: {Sample preparation, e.g. removing encapsulation, etching (sample preparation in general G01N1/00)}
G01R31/2898 (Sample preparation) appears on 90 US grants and 84 published applications in this corpus.
Search patents in G01R- Granted patents
- 90
- Published applications
- 84
- Assignees
- 54
- Inventors
- 229
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 0 |
| 2002 | 5 | 0 |
| 2003 | 4 | 1 |
| 2004 | 4 | 3 |
| 2005 | 6 | 7 |
| 2006 | 5 | 6 |
| 2007 | 5 | 4 |
| 2008 | 4 | 7 |
| 2009 | 2 | 0 |
| 2010 | 3 | 1 |
| 2011 | 2 | 1 |
| 2012 | 1 | 0 |
| 2013 | 1 | 8 |
| 2014 | 1 | 2 |
| 2015 | 6 | 5 |
| 2016 | 2 | 2 |
| 2017 | 6 | 3 |
| 2018 | 3 | 9 |
| 2019 | 3 | 4 |
| 2020 | 1 | 4 |
| 2021 | 3 | 3 |
| 2022 | 4 | 5 |
| 2023 | 3 | 4 |
| 2024 | 4 | 2 |
| 2025 | 4 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structure and method for test-point access in a semiconductor5 May 2026US 12,622,229 B2NXP USA, Inc.
- Contrast-enhancing staining system and method and imaging methods and systems related thereto16 Dec 2025US 12,498,417 B2Techinsights Inc.
- Assembly and method for performing in-situ endpoint detection when backside milling silicon based devices14 Oct 2025US 12,444,658 B2Battelle Memorial Institute
- Method of identifying vulnerable regions in an integrated circuit13 May 2025US 12,298,343 B2Battelle Memorial Institute
- Repackaging IC chip for fault identification1 Apr 2025US 12,265,119 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Assembly and method for performing in-situ endpoint detection when backside milling silicon based devices15 Jan 2026US 2026/0018471 A1Battelle Memorial Institute
- Repackaging ic chip for fault identification17 Jul 2025US 2025/0231233 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of Identifying Vulnerable Regions in an Integrated Circuit19 Jun 2025US 2025/0199061 A1Battelle Memorial Institute
- Structure and method for test-point access in a semiconductor8 Feb 2024US 2024/0047281 A1NXP USA, Inc.
- Repackaging IC Chip For Fault Identification1 Feb 2024US 2024/0036108 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Failure analysis methods and systems43US 7,271,012 B2Control Systemation, Inc. · 2007
- Specific site backside underlaying and micromasking method for electrical characterization of semiconductor devices23US 6,894,522 B2International Business Machines Corporation · 2005
- Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit18US 6,069,366 AAdvanced Micro Devices, Inc. · 2000
- Method and system for integrated circuit backside navigation16US 7,135,123 B1Credence Systems Corporation · 2006
- Stage assembly, particle-optical apparatus comprising such a stage assembly, and method of treating a sample in such an apparatus15US 7,474,419 B2FEI Company · 2009