H10W 90/731
Of die-attach connectors
Official title: {of die-attach connectors}
H10W90/731 (Of die-attach connectors) appears on 34,281 US grants and 40,858 published applications in this corpus.
Search patents in H10W- Granted patents
- 34,281
- Published applications
- 40,858
- Assignees
- 3,255
- Inventors
- 37,645
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 8 | 0 |
| 1978 | 8 | 0 |
| 1979 | 6 | 0 |
| 1980 | 5 | 0 |
| 1981 | 8 | 0 |
| 1982 | 10 | 0 |
| 1983 | 13 | 0 |
| 1984 | 13 | 0 |
| 1985 | 20 | 0 |
| 1986 | 16 | 0 |
| 1987 | 19 | 0 |
| 1988 | 29 | 0 |
| 1989 | 53 | 0 |
| 1990 | 64 | 0 |
| 1991 | 76 | 0 |
| 1992 | 89 | 0 |
| 1993 | 96 | 0 |
| 1994 | 132 | 0 |
| 1995 | 143 | 0 |
| 1996 | 159 | 0 |
| 1997 | 182 | 0 |
| 1998 | 296 | 0 |
| 1999 | 353 | 0 |
| 2000 | 414 | 0 |
| 2001 | 563 | 270 |
| 2002 | 644 | 854 |
| 2003 | 698 | 868 |
| 2004 | 774 | 1036 |
| 2005 | 705 | 1205 |
| 2006 | 759 | 1171 |
| 2007 | 811 | 1301 |
| 2008 | 735 | 1471 |
| 2009 | 776 | 1427 |
| 2010 | 1156 | 1405 |
| 2011 | 1274 | 1380 |
| 2012 | 1217 | 1608 |
| 2013 | 1373 | 1606 |
| 2014 | 1496 | 1778 |
| 2015 | 1679 | 1906 |
| 2016 | 1766 | 1804 |
| 2017 | 1736 | 1725 |
| 2018 | 1557 | 1662 |
| 2019 | 1695 | 1928 |
| 2020 | 1706 | 2275 |
| 2021 | 1641 | 2192 |
| 2022 | 1633 | 2216 |
| 2023 | 1686 | 1860 |
| 2024 | 1531 | 2233 |
| 2025 | 1465 | 2068 |
| 2026 | 990 | 1609 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 90/734Between a chip and a stacked insulating package substrate, interposer or rdl22,674
- H10W 90/736Between a chip and a stacked lead frame, conducting package substrate or11,204
- H10W 90/732Between stacked chips9,323
- H10W 90/737Between a chip and a laterally-adjacent lead frame, conducting package substrate or284
- H10W 90/738Between a chip and a stacked discrete passive device126
- H10W 90/735Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl61
- H10W 90/733Between laterally-adjacent chips54
- H10W 90/739Between a chip and a laterally-adjacent discrete passive devices4
Recent patents
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Bonding layers formed of high thermal conductivity materials6 Oct 2026US 12,757,732 B2APPLIED Materials.Inc.
- Semiconductor package6 Oct 2026US 12,757,745 B2Samsung Electronics Co., Ltd.
- Semiconductor module6 Oct 2026US 12,757,754 B2Denso Corporation
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Pick-and-place tool and method of manufacturing semiconductor structure8 Oct 2026US 2026/0314303 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structure pattern8 Oct 2026US 2026/0314384 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009