H10W 90/738
Between a chip and a stacked discrete passive device
Official title: {between a chip and a stacked discrete passive device}
H10W90/738 (Between a chip and a stacked discrete passive device) appears on 126 US grants and 171 published applications in this corpus.
Search patents in H10W- Granted patents
- 126
- Published applications
- 171
- Assignees
- 80
- Inventors
- 373
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 2 | 2 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 1 | 2 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 3 |
| 2012 | 2 | 0 |
| 2013 | 1 | 2 |
| 2014 | 7 | 9 |
| 2015 | 2 | 10 |
| 2016 | 10 | 8 |
| 2017 | 8 | 9 |
| 2018 | 4 | 7 |
| 2019 | 7 | 9 |
| 2020 | 12 | 16 |
| 2021 | 6 | 15 |
| 2022 | 20 | 22 |
| 2023 | 13 | 8 |
| 2024 | 10 | 19 |
| 2025 | 13 | 16 |
| 2026 | 5 | 10 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods29 Sep 2026US 12,751,306 B2QUALCOMM Incorporated
- Semiconductor device having chip capacitor connected to semiconductor chip with wires8 Sep 2026US 12,733,183 B2Renesas Electronics Corporation
- Semiconductor package18 Aug 2026US 12,713,984 B2Samsung Electronics Co., Ltd.
- Semiconductor device28 Jul 2026US 12,696,767 B2Sumitomo Electric Device Innovations, Inc.
- Integrated circuit packages and methods of forming the same10 Feb 2026US 12,550,784 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronic device package with integrated trench capacitor dies and semiconductor device die6 Aug 2026US 2026/0231818 A1Texas Instruments Incorporated
- Semiconductor device30 Jul 2026US 2026/0223755 A1Rohm Co., Ltd.
- Semiconductor package11 Jun 2026US 2026/0165204 A1Samsung Electronics Co., Ltd.
- Capacitor on integrated circuit package substrate28 May 2026US 2026/0150752 A1Arm Limited
- Power module with vertical power paths7 May 2026US 2026/0130296 A1Monolithic Power Systems, Inc.
Most cited
By later US patents
- Fan out build up substrate stackable package and method29US 8,796,561 B1Amkor Technology, Inc. · 2014
- Panel-level package fabrication of 3D active semiconductor and passive circuit components22US 8,597,979 B12013
- Semiconductor package including a power stage and integrated output inductor22US 9,190,383 B2Infineon Technologies Americas Corp. · 2015
- Bonded structures with integrated passive component19US 11,626,363 B2Adeia Semiconductor Bonding Technologies Inc. · 2023
- Integrating passive components on spacer in stacked dies19US 6,943,294 B2Intel Corporation · 2005