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US 6,943,294 B2Granted
Integrating passive components on spacer in stacked dies
AssigneeIntel Corporation
InventorsJung Kang, Kaladhar Radhakrishnan, Shamala A. Chikamenahalli
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Abstract
An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.
Claims21
A method comprising:
- integrating a capacitor on a spacer between upper and lower dies in stacked dies;
- and
- attaching bumps to electrically connect the capacitor to at least one of the upper and lower dies.
A spacer assembly comprising:
- a capacitor integrated on a spacer between upper and lower dies in stacked dies;
- and
- bumps attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies.
A die assembly comprising:
- a package substrate;
- a plurality of stacked dies on the package substrate and having at least an upper die and a lower die;
- and
- at least a spacer assembly between the upper and lower dies, the spacer assembly comprising:
- a capacitor integrated on a spacer between the upper and lower dies, and
- conductors attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies bumps attached to the capacitor to electrically connect the capacitor to at least one of the upper and lower dies.
3 more elements
Dependencies are inferred from the claim text.