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US 2026/0150752 A1Published application
Capacitor on integrated circuit package substrate
AssigneeArm Limited
InventorsYimajian Yan, Javier DeLaCruz, Cameron Cole Nelson, Sumant Srikant
Life of this patent
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Abstract
An integrated circuit assembly comprises an integrated circuit die and a substrate electrically and physically coupled to the integrated circuit die. A capacitor is physically coupled to the substrate at a location physically between the integrated circuit die and the substrate, the capacitor electrically coupled to the integrated circuit die via at least one electrical connection.
Claims20
An assembly, comprising:
- an integrated circuit die;
- a substrate electrically and physically coupled to the integrated circuit die, and
- a capacitor physically coupled to the substrate at a location physically between the integrated circuit die and the substrate, the capacitor electrically coupled to the integrated circuit die via at least one electrical connection.
A method of forming an assembly, comprising:
- physically and electrically coupling a capacitor to a substrate;
- physically and electrically coupling the substrate to an integrated circuit die such that the capacitor is physically located between the substrate and the integrated circuit die and is electrically coupled to the integrated circuit die.
An assembly, comprising:
- an integrated circuit die;
- a substrate electrically and physically coupled to the integrated circuit die, and
- a power supply component electrically and physically coupled to the substrate at a location physically between the integrated circuit die and the substrate, the substrate electrically coupling the power supply component to the integrated circuit die.
Dependencies are inferred from the claim text.