Bonded structures with integrated passive component

A microelectronic device comprising:

• a first non-deposited insulating substrate;
• a capacitor having a first surface and a second surface opposite the first surface, the first surface of the capacitor mechanically coupled to the first non-deposited insulating substrate;
• a second insulating substrate, the second surface of the capacitor mechanically coupled to the second insulating substrate such that the capacitor is disposed between the first and second insulating substrates;
• an insulating element comprising a first adhesive and a second adhesive, the insulating element disposed between the first and second insulating substrates;
• and
• a first interconnect extending through the first non-deposited insulating substrate and a portion of the insulating element to electrically connect to a first terminal of the capacitor,
• wherein the first surface of the capacitor is mechanically coupled to the first non-deposited insulating substrate by way of the first adhesive and the second surface of the capacitor is mechanically coupled to the second insulating substrate by way of the second adhesive,
• wherein the first non-deposited insulating substrate and the first adhesive are formed of different materials, and the second insulating substrate and the second adhesive are formed of different materials, and
• wherein the first adhesive comprises solder.

A microelectronic device comprising:

• a first non-deposited insulating substrate;
• a capacitor having a first surface, a second surface opposite the first surface, and a sidewall extending between the first and second surfaces, the first surface of the capacitor mechanically coupled to the first non-deposited insulating substrate;
• a second insulating substrate, the second surface of the capacitor mechanically coupled to the second insulating substrate such that the capacitor is disposed between the first and second insulating substrates;
• an insulating element comprising a first adhesive, a second adhesive, and a molding compound separate from the first and second adhesives, the insulating element disposed between the first and second insulating substrates;
• and
• a first interconnect extending through the first non-deposited insulating substrate and a portion of the insulating element to electrically connect to a first terminal of the capacitor,
• wherein the first surface of the capacitor is mechanically coupled to the first non-deposited insulating substrate by way of the first adhesive and the second surface of the capacitor is mechanically coupled to the second insulating substrate by way of the second adhesive, and
• wherein the first non-deposited insulating substrate and the first adhesive are formed of different materials, and the second insulating substrate and the second adhesive are formed of different materials.

A microelectronic device, comprising:

• an insulating material having a first surface and a second surface opposite the first surface;
• a capacitor at least partially embedded within the insulating material, between the first surface and the second surface;
• and
• a first generally planar non-deposited insulating substrate mechanically coupled to the capacitor by way of a first adhesive and disposed over the first surface of the insulating material, the first generally planar non-deposited insulating substrate comprising an interconnect layer disposed on the first surface of the insulating material and arranged to electrically couple one or more terminals of the capacitor to one or more interconnects at or extending through the first surface of the insulating material;
• a second generally planar non-deposited insulating substrate mechanically coupled to the capacitor by way of a second adhesive and disposed over the second surface of the insulating material;
• and
• an element having a nonconductive region, the nonconductive region directly bonded to the first generally planar non-deposited insulating substrate without an intervening adhesive.