H10W 90/732
Between stacked chips
Official title: {between stacked chips}
H10W90/732 (Between stacked chips) appears on 9,323 US grants and 11,734 published applications in this corpus.
Search patents in H10W- Granted patents
- 9,323
- Published applications
- 11,734
- Assignees
- 1,096
- Inventors
- 11,554
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 9 | 0 |
| 1997 | 12 | 0 |
| 1998 | 16 | 0 |
| 1999 | 12 | 0 |
| 2000 | 32 | 0 |
| 2001 | 52 | 37 |
| 2002 | 99 | 162 |
| 2003 | 116 | 191 |
| 2004 | 145 | 230 |
| 2005 | 131 | 287 |
| 2006 | 187 | 325 |
| 2007 | 213 | 365 |
| 2008 | 173 | 438 |
| 2009 | 211 | 400 |
| 2010 | 333 | 421 |
| 2011 | 389 | 417 |
| 2012 | 372 | 491 |
| 2013 | 413 | 497 |
| 2014 | 497 | 504 |
| 2015 | 530 | 594 |
| 2016 | 548 | 507 |
| 2017 | 480 | 508 |
| 2018 | 468 | 484 |
| 2019 | 498 | 577 |
| 2020 | 552 | 677 |
| 2021 | 473 | 681 |
| 2022 | 541 | 740 |
| 2023 | 559 | 556 |
| 2024 | 494 | 634 |
| 2025 | 456 | 567 |
| 2026 | 283 | 444 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor packages and methods for fabricating the same8 Oct 2026US 2026/0314446 A1Samsung Electronics Co., Ltd.
- Semiconductor device assemblies with cavity-embedded cubes and logic-supporting interposers8 Oct 2026US 2026/0314455 A1Micron Technology, Inc.
- Semiconductor device with reduced warpage8 Oct 2026US 2026/0314478 A1Samsung Electronics Co., Ltd.
- Semiconductor device and method for producing semiconductor device8 Oct 2026US 2026/0314503 A1Resonac Corporation
- Semiconductor device and fabrication method thereof1 Oct 2026US 2026/0304754 A1Yangtze Memory Technologies Holding Co., Ltd.
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Packaged semiconductor devices and packaging devices and methods603US 8,778,738 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof505US 6,962,867 B2MicronTechnology, Inc. · 2005