H10W 90/734
Between a chip and a stacked insulating package substrate, interposer or rdl
Official title: {between a chip and a stacked insulating package substrate, interposer or RDL}
H10W90/734 (Between a chip and a stacked insulating package substrate, interposer or rdl) appears on 22,674 US grants and 27,780 published applications in this corpus.
Search patents in H10W- Granted patents
- 22,674
- Published applications
- 27,780
- Assignees
- 2,397
- Inventors
- 26,816
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 7 | 0 |
| 1984 | 8 | 0 |
| 1985 | 16 | 0 |
| 1986 | 8 | 0 |
| 1987 | 10 | 0 |
| 1988 | 17 | 0 |
| 1989 | 26 | 0 |
| 1990 | 33 | 0 |
| 1991 | 29 | 0 |
| 1992 | 40 | 0 |
| 1993 | 44 | 0 |
| 1994 | 63 | 0 |
| 1995 | 58 | 0 |
| 1996 | 67 | 0 |
| 1997 | 86 | 0 |
| 1998 | 162 | 0 |
| 1999 | 206 | 0 |
| 2000 | 250 | 0 |
| 2001 | 344 | 167 |
| 2002 | 409 | 535 |
| 2003 | 426 | 558 |
| 2004 | 489 | 703 |
| 2005 | 460 | 761 |
| 2006 | 483 | 811 |
| 2007 | 537 | 879 |
| 2008 | 506 | 967 |
| 2009 | 521 | 920 |
| 2010 | 748 | 948 |
| 2011 | 844 | 876 |
| 2012 | 773 | 1028 |
| 2013 | 910 | 1115 |
| 2014 | 972 | 1157 |
| 2015 | 1071 | 1279 |
| 2016 | 1158 | 1213 |
| 2017 | 1139 | 1152 |
| 2018 | 1066 | 1164 |
| 2019 | 1212 | 1332 |
| 2020 | 1154 | 1609 |
| 2021 | 1142 | 1553 |
| 2022 | 1153 | 1586 |
| 2023 | 1197 | 1253 |
| 2024 | 1109 | 1562 |
| 2025 | 1042 | 1497 |
| 2026 | 667 | 1155 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor package6 Oct 2026US 12,757,745 B2Samsung Electronics Co., Ltd.
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- Semiconductor packages, semiconductor device and method for manufacturing a semiconductor package6 Oct 2026US 12,757,765 B2Seriphy Technology Corporation
- Pick-and-place tool and method of manufacturing semiconductor structure8 Oct 2026US 2026/0314303 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009