H10W 90/736
Between a chip and a stacked lead frame, conducting package substrate or
Official title: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
H10W90/736 (Between a chip and a stacked lead frame, conducting package substrate or) appears on 11,204 US grants and 12,380 published applications in this corpus.
Search patents in H10W- Granted patents
- 11,204
- Published applications
- 12,380
- Assignees
- 1,589
- Inventors
- 15,685
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 7 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 7 | 0 |
| 1982 | 7 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 8 | 0 |
| 1988 | 11 | 0 |
| 1989 | 20 | 0 |
| 1990 | 30 | 0 |
| 1991 | 42 | 0 |
| 1992 | 46 | 0 |
| 1993 | 50 | 0 |
| 1994 | 67 | 0 |
| 1995 | 82 | 0 |
| 1996 | 95 | 0 |
| 1997 | 86 | 0 |
| 1998 | 140 | 0 |
| 1999 | 165 | 0 |
| 2000 | 179 | 0 |
| 2001 | 226 | 106 |
| 2002 | 238 | 326 |
| 2003 | 266 | 306 |
| 2004 | 278 | 322 |
| 2005 | 244 | 437 |
| 2006 | 274 | 349 |
| 2007 | 270 | 411 |
| 2008 | 235 | 475 |
| 2009 | 263 | 459 |
| 2010 | 374 | 403 |
| 2011 | 409 | 469 |
| 2012 | 405 | 564 |
| 2013 | 451 | 531 |
| 2014 | 500 | 615 |
| 2015 | 599 | 675 |
| 2016 | 649 | 637 |
| 2017 | 612 | 589 |
| 2018 | 517 | 534 |
| 2019 | 499 | 559 |
| 2020 | 503 | 648 |
| 2021 | 465 | 573 |
| 2022 | 405 | 545 |
| 2023 | 441 | 477 |
| 2024 | 389 | 559 |
| 2025 | 367 | 444 |
| 2026 | 254 | 367 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor module6 Oct 2026US 12,757,754 B2Denso Corporation
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Semiconductor device6 Oct 2026US 12,757,766 B2Rohm Co., Ltd.
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Interconnect structure pattern8 Oct 2026US 2026/0314384 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package with an embedded interconnect and a method of making the same8 Oct 2026US 2026/0314436 A1Texas Instruments Incorporated
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
Most cited
By later US patents
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000
- UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light675US 5,813,753 APhilips Electronics North America Corporation · 1998
- Direct build-up layer on an encapsulated die package600US 6,271,469 B1Intel Corporation · 2001
- Multichip integrated circuit modules586US 5,250,843 AIntegrated System Assemblies Corporation · 1993
- Package semiconductor chip567US 4,862,245 AInternational Business Machines Corporation · 1989