H10W 90/733
Between laterally-adjacent chips
Official title: {between laterally-adjacent chips}
H10W90/733 (Between laterally-adjacent chips) appears on 54 US grants and 126 published applications in this corpus.
Search patents in H10W- Granted patents
- 54
- Published applications
- 126
- Assignees
- 51
- Inventors
- 299
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 2 | 2 |
| 2017 | 1 | 3 |
| 2018 | 2 | 2 |
| 2019 | 2 | 4 |
| 2020 | 3 | 5 |
| 2021 | 6 | 7 |
| 2022 | 2 | 16 |
| 2023 | 5 | 10 |
| 2024 | 11 | 10 |
| 2025 | 16 | 25 |
| 2026 | 2 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Semiconductor device and circuit device24 Feb 2026US 12,564,100 B2Renesas Electronics Corporation
- Semiconductor device having redistribution layers formed on an active wafer and methods of making the same25 Nov 2025US 12,482,753 B2Taiwan Semiconductor Manufacturing Company.Ltd
- High bandwidth memory stack with side edge interconnection and 3D IC structure with the same11 Nov 2025US 12,469,836 B2Etron Technology, Inc.
- Semiconductor device28 Oct 2025US 12,456,712 B2Nuvoton Technology Corporation Japan
- Electronic module1 Oct 2026US 2026/0305442 A1Shindengen Electric Manufacturing Co., Ltd.
- Die attachment film, dicing die bonding film, and semiconductor device manufacturing method1 Oct 2026US 2026/0305443 A1Resonac Corporation
- Package structure and method of forming the same17 Sep 2026US 2026/0283013 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device17 Sep 2026US 2026/0283022 A1Kabushiki Kaisha Toshiba
- Semiconductor memory and manufacturing method thereof27 Aug 2026US 2026/0256025 A1Kioxia Corporation
Most cited
By later US patents
- Cavity bridge connection for die split architecture86US 9,443,824 B1QUALCOMM Incorporated · 2016
- Semiconductor assembly having bridge module for die-to-die interconnection18US 9,418,966 B1Xilinx, Inc. · 2016
- Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers16US 11,094,637 B2International Business Machines Corporation · 2021
- Method of manufacturing a semiconductor device16US 5,533,664 AKabushiki Kaisha Toshiba · 1996
- Laser sintered interconnections between die14US 9,935,079 B1NXP USA, Inc. · 2018