Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsEitaro MIYAKE, Jia LIU
Life of this patent
Estimating the term…
Abstract
According to an embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip and the second semiconductor chip each have a first electrode and a second electrode. The first electrode of the first semiconductor chip and the first electrode of the second semiconductor chip face each other and are arranged with a conductive connector sandwiched therebetween. The second electrodes are electrically connected to external electrodes externally exposed and spaced apart from each other.
Claims10
A semiconductor device comprising:
- a first semiconductor chip;
- and
- a second semiconductor chip,
- wherein the first semiconductor chip and the second semiconductor chip each have a first electrode and a second electrode and the first electrode of the first semiconductor chip and the first electrode of the second semiconductor chip face each other and are arranged with a conductive connector sandwiched therebetween, and
- wherein the second electrodes are electrically connected to external electrodes externally exposed and spaced apart from each other.
Dependencies are inferred from the claim text.