Cavity bridge connection for die split architecture
AssigneeQUALCOMM Incorporated
InventorsHong Bok We, Jae Sik Lee, Dong Wook Kim
Life of this patent
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Abstract
An integrated circuit (IC) package structure may include a substrate. The substrate may include a semiconductor bridge having a first surface directly on a surface of the substrate that faces a first semiconductor die and a second semiconductor die. The semiconductor bridge may be disposed within a cavity extending through a photo-sensitive layer on the surface of the substrate. The semiconductor bridge may have an exposed, second surface substantially flush with the photo-sensitive layer. The first semiconductor die and the second semiconductor die are supported by the substrate and coupled together through the semiconductor bridge.
Claims20
An integrated circuit (IC) package structure, comprising:
- a substrate;
- a semiconductor bridge having a first surface directly on a surface of the substrate facing a first semiconductor die and a second semiconductor die, the semiconductor bridge disposed within a cavity extending through a photo-sensitive layer on the surface of the substrate and having an exposed, second surface substantially flush with the photo-sensitive layer;
- and
- the first semiconductor die and the second semiconductor die supported by the substrate and coupled together through the semiconductor bridge.
An integrated circuit (IC) package structure, comprising:
- a substrate;
- a semiconductor bridge having a first surface directly on a surface of the substrate facing a first semiconductor die and a second semiconductor die supported by the substrate, the semiconductor bridge disposed within a cavity extending through a photo-sensitive layer on the surface of the substrate and having an exposed, second surface substantially flush with the photo-sensitive layer;
- and
- means for coupling the first semiconductor die and the second semiconductor die through the semiconductor bridge.
Dependencies are inferred from the claim text.