Semiconductor device having redistribution layers formed on an active wafer and methods of making the same

A method of fabricating a semiconductor device, comprising:

• forming one or more redistribution layers on a surface of a semiconductor die such that the one or more redistribution layers are electrically coupled to the semiconductor die;
• forming a molding material matrix on a surface of the one or more redistribution layers;
• forming a through-molding-material via that is electrically coupled to the one or more redistribution layers;
• and
• attaching an interconnect die to the one or more redistribution layers such that the interconnect die is adjacent the through-molding-material via and coupled to the one or more redistribution layers.

A method of fabricating a semiconductor device, comprising:

• forming one or more first redistribution layers directly on a surface of a semiconductor die such that the one or more first redistribution layers are electrically coupled to the semiconductor die;
• forming one or more second redistribution layers directly on a surface of an interconnect die;
• forming a through-molding-material via on the one or more first redistribution layers;
• and
• attaching the interconnect die to the one or more first redistribution layers such that the interconnect die is adjacent the through-molding-material via and coupled to the one or more first redistribution layers.