Semiconductor assembly having bridge module for die-to-die interconnection

An integrated circuit (IC) package, comprising:

• a package substrate;
• a first integrated circuit (IC) die having, on a top side thereof, first interconnects of a plurality of interconnects and first inter-die contacts of a plurality of inter-die contacts, the first interconnects electrically and mechanically coupled to a top side of the package substrate and disposed outside of the package substrate;
• a second IC die having, on a top side thereof, second interconnects of the plurality of interconnects and second inter-die contacts of the plurality of inter-die contracts, the second interconnects electrically and mechanically coupled to the top side of the package substrate and disposed outside of the package substrate;
• and
• a bridge module disposed between the first interconnects and the second interconnects, a backside of the bridge module being spaced apart from the package substrate and not extending beyond a height of the plurality of interconnects, the bridge module including:
• bridge interconnects on a top side of the bridge module, the bridge interconnects mechanically and electrically coupled to the plurality of inter-die contacts;
• and
• one or more layers of conductive interconnect disposed on the top side of the bridge module configured to route signals between the first IC and the second IC.