H10W 90/735
Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl
Official title: {between a chip and a laterally-adjacent insulating package substrate, interposer or RDL}
H10W90/735 (Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl) appears on 61 US grants and 105 published applications in this corpus.
Search patents in H10W- Granted patents
- 61
- Published applications
- 105
- Assignees
- 56
- Inventors
- 243
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 1 |
| 2012 | 2 | 5 |
| 2013 | 3 | 2 |
| 2014 | 2 | 2 |
| 2015 | 1 | 2 |
| 2016 | 1 | 5 |
| 2017 | 5 | 4 |
| 2018 | 3 | 7 |
| 2019 | 5 | 7 |
| 2020 | 9 | 7 |
| 2021 | 6 | 7 |
| 2022 | 4 | 12 |
| 2023 | 7 | 7 |
| 2024 | 8 | 7 |
| 2025 | 1 | 16 |
| 2026 | 4 | 11 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor chip and manufacturing method therefor21 Apr 2026US 12,610,760 B2Sony Semiconductor Solutions Corporation
- Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same21 Apr 2026US 12,610,819 B2Adeia Semiconductor Bonding Technologies Inc.
- Display device including a wiring pad and method for manufacturing the same10 Feb 2026US 12,550,445 B2Samsung Display Co., Ltd.
- Semiconductor package including adhesive layer and method for manufacturing the same4 Feb 2025US 12,218,065 B2Samsung Electronics Co., Ltd.
- Semiconductor module arrangement24 Sep 2026US 2026/0293776 A1
- Semiconductor Device and Method of Making Using Ultraviolet Light for Photonics Protection17 Sep 2026US 2026/0283012 A1STATS ChipPAC Pte. Ltd.
- Stacked package structure and method for forming the same9 Jul 2026US 2026/0198387 A1JCET Microelectronics (Jiangyin) Co., LTD.
- Glass core for packaging and method of manufacturing glass core for packaging28 May 2026US 2026/0150735 A1Absolics Inc.
- Stacking and Racking Semiconductor Chips Glass or Ceramic Circuits28 May 2026US 2026/0150762 A1Sciperio, Inc
Most cited
By later US patents
- Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect32US 9,893,045 B2STATS ChipPAC Pte. Ltd. · 2018
- Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect21US 8,383,457 B2STATS ChipPAC, Ltd. · 2013
- Chip scale package with electronic component received in encapsulant, and fabrication method thereof9US 9,040,361 B2Siliconware Precision Industries Co., Ltd. · 2015
- Control of under-fill using under-fill deflash for a dual-sided ball grid array package7US 10,410,885 B2Skyworks Solutions, Inc. · 2019
- Electronic package with stacked semiconductor chips6US 8,476,738 B22013