Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

A method of making a semiconductor device, comprising:

• providing a carrier;
• mounting a first semiconductor die over the carrier;
• depositing an encapsulant over the carrier and first semiconductor die;
• providing an interposer frame including an opening in the interposer frame and a plurality of conductive pillars formed over the interposer frame;
• mounting the interposer frame over the carrier and first semiconductor die by pressing the interposer frame against the encapsulant;
• removing the carrier;
• and
• forming an interconnect structure over the encapsulant and first semiconductor die.

A method of making a semiconductor device, comprising:

• providing a first semiconductor die;
• providing an interposer frame including an opening in the interposer frame and a plurality of conductive pillars formed over the interposer frame;
• mounting the interposer frame over the first semiconductor die including disposing the conductive pillars around the first semiconductor die;
• depositing an encapsulant over the first semiconductor die;
• and
• forming an interconnect structure over the encapsulant and first semiconductor die.