A method for fabricating an electronic component package, comprising:
- providing a packaging layer;
- forming a first level electronic component package module on a surface of the packaging layer, wherein the first level electronic component package module is fabricated by laminating at least two semiconductor wafers together, and the semiconductor wafers respectively comprise at least two semiconductor chips separated from each other by a trench;
- forming an exterior connection structure, said exterior connection structure comprising a first redistribution layer on a bottom surface of the first level electronic component package module, wherein the first redistribution layer is electrically connected to the first level electronic component package module;
- forming a second level electronic component package module on a bottom surface of the first redistribution layer, wherein the second level electronic component package module is fabricated by laminating at least two semiconductor wafers together, and the semiconductor wafers respectively comprise at least two semiconductor chips isolated from each other by a trench;
- forming a conductive bump on a bottom surface of the second level electronic component package module, electrically connected to the second level electronic component package module and the first redistribution layer,
- wherein each of the first and second level electronic component package modules respectively further comprise:
- an interior connection structure, comprising a conductive trace layer conformably mounted on sides and backsides of the corresponding electronic component package module, respectively electrically connecting the first and the second level electronic component package modules, wherein at least one package module of the first and second level electronic component package modules further comprises:
- at least two conductive pads respectively disposed on and electrically connected to the two semiconductor chips of the corresponding package module and the at least two conductive pads extending to the sides of the package module to electrically connect to the conductive trace layer,
- wherein the first redistribution layer is provided between the first and the second level electronic component package modules, respectively electrically connected to the conductive trace layer of the first and the second level electronic component package modules, and
- wherein the interior connection structure and the exterior connection structure are different.