H10W 20/023
The interconnections being through-semiconductor vias
Official title: {the interconnections being through-semiconductor vias}
H10W20/023 (The interconnections being through-semiconductor vias) appears on 7,377 US grants and 9,394 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,377
- Published applications
- 9,394
- Assignees
- 892
- Inventors
- 9,359
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 11 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 9 | 0 |
| 1996 | 10 | 0 |
| 1997 | 8 | 0 |
| 1998 | 15 | 0 |
| 1999 | 15 | 0 |
| 2000 | 22 | 0 |
| 2001 | 29 | 16 |
| 2002 | 50 | 62 |
| 2003 | 54 | 75 |
| 2004 | 67 | 121 |
| 2005 | 81 | 147 |
| 2006 | 117 | 213 |
| 2007 | 82 | 201 |
| 2008 | 97 | 242 |
| 2009 | 143 | 247 |
| 2010 | 218 | 344 |
| 2011 | 275 | 424 |
| 2012 | 300 | 494 |
| 2013 | 442 | 463 |
| 2014 | 477 | 519 |
| 2015 | 478 | 568 |
| 2016 | 543 | 417 |
| 2017 | 467 | 401 |
| 2018 | 404 | 369 |
| 2019 | 363 | 364 |
| 2020 | 356 | 418 |
| 2021 | 377 | 460 |
| 2022 | 326 | 544 |
| 2023 | 396 | 625 |
| 2024 | 427 | 660 |
| 2025 | 425 | 612 |
| 2026 | 251 | 388 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 20/0245Comprising use of blind vias during the manufacture3,091
- H10W 20/0234Comprising etching via holes that stop on pads or on electrodes2,489
- H10W 20/0242Comprising etching via holes from the back sides of the chips, wafers2,343
- H10W 20/0249Wherein the through-semiconductor via protrudes from backsides of the chips, wafers or864
- H10W 20/0261Characterised by the filling method or the material of the conductive fill724
- H10W 20/0238Comprising etching via holes through pads or through electrodes619
- H10W 20/0265Characterised by the sidewall insulation584
- H10W 20/0253Comprising forming the through-semiconductor vias after stacking of the chips, wafers or467
All 9 subgroupsShow fewer
Recent patents
- Semiconductor substrate comprising a through-substrate-via and method for producing thereof6 Oct 2026US 12,757,705 B2ams-OSRAM AG
- Semiconductor device with polymer liner and method for fabricating the same6 Oct 2026US 12,757,707 B2Nanya Technology Corporation
- Semiconductor device having a through contact connected to a buried pattern and penetrating a field insulation film and an etch stop layer6 Oct 2026US 12,757,719 B2Samsung Electronics Co., Ltd.
- Barrier layers for interconnects in bonded wafers6 Oct 2026US 12,757,721 B2United Microelectronics Corp.
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Air liner for through substrate via8 Oct 2026US 2026/0313968 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for forming through wafer via8 Oct 2026US 2026/0314349 A1Skyworks Solutions, Inc.
- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
- Via structure and method for forming the same8 Oct 2026US 2026/0314367 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Dummy structure for chip-on-wafer-on-substrate961US 9,425,126 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices775US 7,157,787 B2Intel Corporation · 2007
- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001