H10W 20/0234
Comprising etching via holes that stop on pads or on electrodes
Official title: {comprising etching via holes that stop on pads or on electrodes}
H10W20/0234 (Comprising etching via holes that stop on pads or on electrodes) appears on 2,489 US grants and 3,016 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,489
- Published applications
- 3,016
- Assignees
- 359
- Inventors
- 3,376
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 6 | 0 |
| 2000 | 9 | 0 |
| 2001 | 10 | 9 |
| 2002 | 16 | 12 |
| 2003 | 13 | 15 |
| 2004 | 9 | 31 |
| 2005 | 25 | 33 |
| 2006 | 29 | 62 |
| 2007 | 21 | 65 |
| 2008 | 44 | 74 |
| 2009 | 41 | 78 |
| 2010 | 61 | 101 |
| 2011 | 78 | 133 |
| 2012 | 81 | 158 |
| 2013 | 138 | 133 |
| 2014 | 162 | 156 |
| 2015 | 141 | 176 |
| 2016 | 177 | 149 |
| 2017 | 163 | 144 |
| 2018 | 148 | 140 |
| 2019 | 131 | 127 |
| 2020 | 126 | 190 |
| 2021 | 152 | 179 |
| 2022 | 139 | 216 |
| 2023 | 153 | 221 |
| 2024 | 161 | 191 |
| 2025 | 147 | 132 |
| 2026 | 66 | 91 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device having a through contact connected to a buried pattern and penetrating a field insulation film and an etch stop layer6 Oct 2026US 12,757,719 B2Samsung Electronics Co., Ltd.
- Through-substrate-via in photosensitive module25 Aug 2026US 12,720,900 B2Semiconductor Components Industries, LLC
- Integrated circuit device25 Aug 2026US 12,721,135 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method for manufacturing the same25 Aug 2026US 12,721,136 B2Samsung Electronics Co., Ltd.
- Sensor system25 Aug 2026US 12,721,230 B2Illumina, Inc.
- Method for forming through wafer via8 Oct 2026US 2026/0314349 A1Skyworks Solutions, Inc.
- Semiconductor device and methods of forming the same13 Aug 2026US 2026/0239629 A1Nanya Technology Corporation
- Semiconductor structure, forming method thereof, semiconductor device and memory system13 Aug 2026US 2026/0239630 A1Yangtze Memory Technologies Co., Ltd.
- Semiconductor structure and methods of forming the same13 Aug 2026US 2026/0239732 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of manufacturing semiconductor device6 Aug 2026US 2026/0231462 A1Sumitomo Electric Device Innovations, Inc.
Most cited
By later US patents
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices775US 7,157,787 B2Intel Corporation · 2007
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices528US 6,762,076 B2Intel Corporation · 2004
- Three-dimensional integrated semiconductor devices526US 6,943,067 B2Advanced Micro Devices, Inc. · 2005
- High density data storage using stacked wafers481US 5,229,647 AMicron Technology, Inc. · 1993
- Multi-dice chip scale semiconductor components and wafer level methods of fabrication456US 6,841,883 B1Micron Technology, Inc. · 2005