Semiconductor structure, forming method thereof, semiconductor device and memory system

A method of forming a semiconductor structure, comprising:

• forming a first semiconductor structure comprising an array of memory cells;
• forming a second semiconductor structure on a substrate, the second semiconductor structure comprising a peripheral circuit structure;
• bonding a first surface of the second semiconductor structure with the first semiconductor structure to connect the peripheral circuit structure with the array of memory cells;
• forming a contact structure extending through the substrate along a first direction perpendicular to the first surface;
• forming a first conductive pad and a second conductive pad connected with different contact structures respectively at a second surface of the second semiconductor structure to connect the array of memory cells with the first conductive pad and the second conductive pad, the second surface being opposite to the first surface, wherein the first conductive pad is at least one of a polygon, a circle or an ellipse, wherein the polygon has more than 4 sides, and wherein the second conductive pad is a quadrangle;
• and
• forming at least one conductive line connected with a surface of the second conductive pad.

A semiconductor device, comprising:

• a semiconductor structure, comprising:
• a first semiconductor structure comprising an array of memory cells;
• and
• a first conductive pad and a second conductive pad disposed at a surface of the semiconductor structure, wherein the array of memory cells is connected with the first conductive pad and the second conductive pad respectively at least through different contact structures, wherein the contact structures at least partially extend through the semiconductor structure along a first direction, wherein the first direction is perpendicular to the surface of the semiconductor structure, wherein the first conductive pad is at least one of a polygon, a circle or an ellipse, wherein the polygon has more than 4 sides, wherein a surface of the second conductive pad is connected with at least one conductive line, and wherein the second conductive pad is a quadrangle.