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US 2026/0314349 A1Published application
Method for forming through wafer via
AssigneeSkyworks Solutions, Inc.
InventorKezia Cheng
Life of this patent
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Abstract
Disclosed herein is a method of forming a through wafer via in a substrate. The method comprises defining an aperture in the substrate, the aperture defining one of a through hole passing entirely through the substrate from a front side of the substrate to a rear side of the substrate or a blind hole terminating on a metal pad disposed on the rear side of the substrate, depositing a copper paste within the aperture, and sintering the copper paste.
Claims14
A method of forming a through wafer via in a substrate, the method comprising:
- defining an aperture in the substrate, the aperture defining one of a through hole passing entirely through the substrate from a front side of the substrate to a rear side of the substrate or a blind hole terminating on a metal pad disposed on the rear side of the substrate;
- depositing a copper paste within the aperture;
- and
- sintering the copper paste.
1 more element
Dependencies are inferred from the claim text.