H10W 20/0249
Wherein the through-semiconductor via protrudes from backsides of the chips, wafers or
Official title: {wherein the through-semiconductor via protrudes from backsides of the chips, wafers or substrates during the manufacture}
H10W20/0249 (Wherein the through-semiconductor via protrudes from backsides of the chips, wafers or) appears on 864 US grants and 1,081 published applications in this corpus.
Search patents in H10W- Granted patents
- 864
- Published applications
- 1,081
- Assignees
- 153
- Inventors
- 1,234
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 7 |
| 2003 | 3 | 4 |
| 2004 | 6 | 23 |
| 2005 | 15 | 37 |
| 2006 | 27 | 26 |
| 2007 | 14 | 28 |
| 2008 | 20 | 19 |
| 2009 | 18 | 37 |
| 2010 | 22 | 59 |
| 2011 | 39 | 55 |
| 2012 | 46 | 52 |
| 2013 | 54 | 68 |
| 2014 | 55 | 67 |
| 2015 | 71 | 72 |
| 2016 | 52 | 36 |
| 2017 | 57 | 40 |
| 2018 | 40 | 21 |
| 2019 | 26 | 44 |
| 2020 | 28 | 33 |
| 2021 | 38 | 51 |
| 2022 | 31 | 70 |
| 2023 | 57 | 76 |
| 2024 | 51 | 73 |
| 2025 | 59 | 43 |
| 2026 | 23 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and method of fabricating the same25 Aug 2026US 12,721,223 B2Samsung Electronics Co., Ltd.
- Semiconductor package including stacked chips and method of manufacturing the semiconductor package18 Aug 2026US 12,713,985 B2Samsung Electronics Co., Ltd.
- Integrated circuit chip with backside power delivery and multiple types of backside to frontside vias26 May 2026US 12,642,077 B2International Business Machines Corporation
- Semiconductor package and method of fabricating the same26 May 2026US 12,642,139 B2Samsung Electronics Co., Ltd.
- Semiconductor chip package with through electrode configuration under recessed connection pad19 May 2026US 12,635,568 B2Samsung Electronics Co., Ltd.
- Semiconductor device and methods of forming the same13 Aug 2026US 2026/0239629 A1Nanya Technology Corporation
- Chip stack structure and semiconductor package including the same13 Aug 2026US 2026/0239963 A1Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing the same6 Aug 2026US 2026/0231814 A1Samsung Electronics Co., Ltd.
- Alignment method of semiconductor chip, bonding method, semiconductor device, and electronic component manufacturing system30 Jul 2026US 2026/0223729 A1Tohoku University
- Semiconductor devices including insulating structure16 Jul 2026US 2026/0206596 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Multi-dice chip scale semiconductor components and wafer level methods of fabrication456US 6,841,883 B1Micron Technology, Inc. · 2005
- Trench method for three dimensional chip connecting during IC fabrication430US 5,627,106 AUnited Microelectronics Corp. · 1997
- Integrated circuits and methods for their fabrication410US 6,184,060 B2TruSi Technologies, LLC · 2001
- Process for producing semiconductor components between which contact is made vertically392US 5,767,001 ASiemens Aktiengesellschaft · 1998
- Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities352US 7,049,170 B2Tru-Si Technologies, Inc. · 2006