H10W 20/0238
Comprising etching via holes through pads or through electrodes
Official title: {comprising etching via holes through pads or through electrodes}
H10W20/0238 (Comprising etching via holes through pads or through electrodes) appears on 619 US grants and 709 published applications in this corpus.
Search patents in H10W- Granted patents
- 619
- Published applications
- 709
- Assignees
- 144
- Inventors
- 813
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 4 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 6 | 11 |
| 2003 | 8 | 7 |
| 2004 | 11 | 30 |
| 2005 | 18 | 36 |
| 2006 | 20 | 39 |
| 2007 | 22 | 37 |
| 2008 | 21 | 32 |
| 2009 | 30 | 32 |
| 2010 | 33 | 33 |
| 2011 | 34 | 41 |
| 2012 | 31 | 41 |
| 2013 | 37 | 22 |
| 2014 | 41 | 38 |
| 2015 | 29 | 43 |
| 2016 | 39 | 25 |
| 2017 | 40 | 32 |
| 2018 | 26 | 28 |
| 2019 | 25 | 24 |
| 2020 | 21 | 24 |
| 2021 | 22 | 27 |
| 2022 | 22 | 29 |
| 2023 | 20 | 25 |
| 2024 | 24 | 24 |
| 2025 | 17 | 18 |
| 2026 | 5 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit device25 Aug 2026US 12,721,135 B2Samsung Electronics Co., Ltd.
- Advanced interconnection for wafer on wafer packaging9 Jun 2026US 12,653,013 B2Micron Technology, Inc.
- Semiconductor device including image sensor and methods of forming the same3 Mar 2026US 12,568,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device having wiring part without being exposed from substrate3 Mar 2026US 12,568,833 B2Advantest Corporation
- Integrated circuit structures with deep via structure24 Feb 2026US 12,563,774 B2Intel Corporation
- Methods for forming heat dissipation pathways in a stacked device6 Aug 2026US 2026/0231840 A1Tokyo Electron Limited
- Stacked capacitor device and manufacturing method thereof30 Jul 2026US 2026/0223666 A1Winbond Electronics Corp.
- Semiconductor device and method for forming the same9 Jul 2026US 2026/0198280 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device including image sensor and methods of forming the same25 Jun 2026US 2026/0182067 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor chip and semiconductor stack structure including the same11 Jun 2026US 2026/0165105 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Three-dimensional multichip package444US 5,481,133 AUnited Microelectronics Corp. · 1996
- 3D IC method and device388US 7,485,968 B2Ziptronix, Inc. · 2009
- Chip size semiconductor packages with stacked dies338US 6,577,013 B1Amkor Technology, Inc. · 2003
- Three-dimensional multichip package and methods of fabricating333US 5,380,681 AUnited Microelectronics Corp. · 1995
- High density integrated circuit packaging with chip stacking and via interconnections322US 6,002,177 AInternational Business Machines Corporation · 1999