Semiconductor device having wiring part without being exposed from substrate
AssigneesTokyo Institute of Technology, Advantest Corporation
InventorsTakayuki Ohba, Shinji Sugatani
Life of this patent
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Abstract
A semiconductor device includes a power supply and ground layer and a semiconductor chip disposed over the power supply and ground layer. The power supply and ground layer includes a substrate and a wiring part. The substrate has one or more grooves whose openings are directed toward the semiconductor chip, and the wiring part is disposed within the one or more grooves via an insulating layer and is formed in a predetermined pattern. The substrate is connected to ground wiring of the semiconductor chip and the wiring part is connected to power supply wiring of the semiconductor chip. The wiring part is not exposed from a back surface of the substrate.
Claims15
A semiconductor device comprising:
- a power supply and ground layer, the power supply and ground layer including a substrate and a wiring part;
- a semiconductor chip disposed over the power supply and ground layer, the semiconductor chip including through-electrodes disposed inside the semiconductor chip;
- and
- a first insulating layer extending between the semiconductor chip and the power supply and ground layer,
- wherein the substrate has one or more grooves whose openings are directed toward the semiconductor chip, and the wiring part is disposed within the one or more grooves via a second insulating layer and is formed in a predetermined pattern,
- wherein the substrate is connected to ground wiring of the semiconductor chip and the wiring part is connected to power supply wiring of the semiconductor chip,
- wherein the wiring part is not exposed from a bottom portion of the substrate in a state in which the wiring part is covered by the bottom portion whose surface has been ground and polished such that the bottom portion of the substrate has a predetermined thickness, and
- wherein the through-electrodes penetrate through the first insulating layer.
Dependencies are inferred from the claim text.