H10W 20/0245
Comprising use of blind vias during the manufacture
Official title: {comprising use of blind vias during the manufacture}
H10W20/0245 (Comprising use of blind vias during the manufacture) appears on 3,091 US grants and 3,976 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,091
- Published applications
- 3,976
- Assignees
- 464
- Inventors
- 4,384
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 9 | 1 |
| 2002 | 17 | 25 |
| 2003 | 19 | 35 |
| 2004 | 35 | 56 |
| 2005 | 32 | 67 |
| 2006 | 52 | 95 |
| 2007 | 38 | 89 |
| 2008 | 36 | 102 |
| 2009 | 67 | 122 |
| 2010 | 108 | 189 |
| 2011 | 151 | 210 |
| 2012 | 156 | 240 |
| 2013 | 221 | 225 |
| 2014 | 223 | 239 |
| 2015 | 224 | 228 |
| 2016 | 213 | 153 |
| 2017 | 189 | 151 |
| 2018 | 158 | 121 |
| 2019 | 112 | 119 |
| 2020 | 137 | 134 |
| 2021 | 123 | 187 |
| 2022 | 115 | 214 |
| 2023 | 167 | 282 |
| 2024 | 177 | 283 |
| 2025 | 189 | 208 |
| 2026 | 83 | 201 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
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- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001
- Three-dimensional integrated circuit and manufacturing method thereof617US 4,939,568 AFujitsu Limited · 1990
- Plasma activated conformal film deposition548US 8,728,956 B2Novellus Systems, Inc. · 2014