H05K 3/00
Apparatus or processes for manufacturing printed circuits
H05K3/00 (Apparatus or processes for manufacturing printed circuits) appears on 56,739 US grants and 52,773 published applications in this corpus.
Search patents in H05K- Granted patents
- 56,739
- Published applications
- 52,773
- Assignees
- 9,812
- Inventors
- 84,366
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 198 | 0 |
| 1977 | 187 | 0 |
| 1978 | 202 | 0 |
| 1979 | 132 | 0 |
| 1980 | 189 | 0 |
| 1981 | 241 | 0 |
| 1982 | 248 | 0 |
| 1983 | 296 | 0 |
| 1984 | 327 | 0 |
| 1985 | 438 | 0 |
| 1986 | 440 | 0 |
| 1987 | 573 | 0 |
| 1988 | 536 | 0 |
| 1989 | 681 | 0 |
| 1990 | 738 | 0 |
| 1991 | 820 | 0 |
| 1992 | 803 | 0 |
| 1993 | 820 | 0 |
| 1994 | 820 | 0 |
| 1995 | 860 | 0 |
| 1996 | 815 | 0 |
| 1997 | 845 | 0 |
| 1998 | 1188 | 0 |
| 1999 | 1338 | 0 |
| 2000 | 1355 | 0 |
| 2001 | 1659 | 750 |
| 2002 | 1719 | 1945 |
| 2003 | 1820 | 2051 |
| 2004 | 1749 | 2288 |
| 2005 | 1356 | 2421 |
| 2006 | 1453 | 2470 |
| 2007 | 1412 | 2553 |
| 2008 | 1339 | 2596 |
| 2009 | 1366 | 2794 |
| 2010 | 1737 | 2359 |
| 2011 | 1688 | 1951 |
| 2012 | 1841 | 1765 |
| 2013 | 1505 | 1870 |
| 2014 | 1457 | 2438 |
| 2015 | 1669 | 2478 |
| 2016 | 1906 | 2131 |
| 2017 | 1990 | 1997 |
| 2018 | 1849 | 1929 |
| 2019 | 2005 | 2042 |
| 2020 | 1861 | 2110 |
| 2021 | 1692 | 1948 |
| 2022 | 1569 | 1871 |
| 2023 | 1404 | 1775 |
| 2024 | 1458 | 1697 |
| 2025 | 1354 | 1386 |
| 2026 | 791 | 1158 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/30Assembling printed circuits with electric components21,754
- H05K 3/46Manufacturing multilayer circuits11,335
- H05K 3/22Secondary treatment of printed circuits10,789
- H05K 3/10In which conductive material is applied to the insulating support in such10,032
- H05K 3/40Forming printed elements for providing electric connections to or between printed circuits9,658
- H05K 3/0011Working of insulating substrates or insulating layers6,025
- H05K 3/36Assembling printed circuits with other printed circuits4,886
- H05K 3/02In which the conductive material is applied to the surface of the4,805
All 20 subgroupsShow fewer
- H05K 3/38Improvement of the adhesion between the insulating substrate and the metal3,839
- H05K 3/0058Laminating printed circuit boards onto other substrates2,250
- H05K 3/0073Masks not provided for in groups h05k3/02 - h05k3/461,027
- H05K 3/0097Processing two or more printed circuits simultaneously789
- H05K 3/44Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits599
- H05K 3/007Manufacture or processing of a substrate for a printed circuit board supported589
- H05K 3/0094Filling or covering plated through-holes or blind plated vias536
- H05K 3/0005Apparatus or processes for manufacturing printed circuits: for designing circuits by computer524
- H05K 3/0008Apparatus or processes for manufacturing printed circuits: for aligning or positioning of415
- H05K 3/0085Apparatus for treatments of printed circuits with liquids not provided for in268
- H05K 3/0091Apparatus for coating printed circuits using liquid non-metallic coating compositions260
- H05K 3/0002Apparatus or processes for manufacturing printed circuits: for manufacturing artworks for printed151
Recent patents
- Method of fabricating metal mask6 Oct 2026US 12,752,329 B2Darwin Precisions Corporation
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Technologies for reducing the impact of radiofrequency interference on a circuit board6 Oct 2026US 12,757,317 B2Intel Corporation
- Camera module8 Oct 2026US 2026/0309956 A1LG Innotek Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Method for manufacturing conductive tracks and transparent laminated pane8 Oct 2026US 2026/0313788 A1ams-OSRAM International GmbH
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
Most cited
By later US patents
- Two-layer capacitive touchpad and method of making same2,193US 6,188,391 B1Synaptics Incorporated · 2001
- Programmer1,483US 4,213,562 A1980
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Three-dimensional printing techniques1,084US 5,204,055 AMassachusetts Institute of Technology · 1993
- Formation of microstamped patterns on surfaces and derivative articles1,049US 5,512,131 APresident and Fellows of Harvard College · 1996