H05K 3/0011
Working of insulating substrates or insulating layers
Official title: {Working of insulating substrates or insulating layers}
H05K3/0011 (Working of insulating substrates or insulating layers) appears on 6,025 US grants and 5,954 published applications in this corpus.
Search patents in H05K- Granted patents
- 6,025
- Published applications
- 5,954
- Assignees
- 1,978
- Inventors
- 12,115
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 12 | 0 |
| 1978 | 9 | 0 |
| 1979 | 9 | 0 |
| 1980 | 17 | 0 |
| 1981 | 19 | 0 |
| 1982 | 21 | 0 |
| 1983 | 18 | 0 |
| 1984 | 28 | 0 |
| 1985 | 34 | 0 |
| 1986 | 47 | 0 |
| 1987 | 47 | 0 |
| 1988 | 45 | 0 |
| 1989 | 74 | 0 |
| 1990 | 81 | 0 |
| 1991 | 82 | 0 |
| 1992 | 78 | 0 |
| 1993 | 94 | 0 |
| 1994 | 94 | 0 |
| 1995 | 84 | 0 |
| 1996 | 84 | 0 |
| 1997 | 97 | 0 |
| 1998 | 106 | 0 |
| 1999 | 127 | 0 |
| 2000 | 129 | 0 |
| 2001 | 175 | 88 |
| 2002 | 162 | 233 |
| 2003 | 207 | 220 |
| 2004 | 217 | 255 |
| 2005 | 144 | 253 |
| 2006 | 141 | 267 |
| 2007 | 147 | 273 |
| 2008 | 136 | 267 |
| 2009 | 118 | 250 |
| 2010 | 170 | 227 |
| 2011 | 151 | 194 |
| 2012 | 202 | 159 |
| 2013 | 149 | 144 |
| 2014 | 135 | 202 |
| 2015 | 144 | 261 |
| 2016 | 192 | 270 |
| 2017 | 209 | 298 |
| 2018 | 261 | 276 |
| 2019 | 283 | 256 |
| 2020 | 254 | 276 |
| 2021 | 210 | 229 |
| 2022 | 199 | 225 |
| 2023 | 157 | 200 |
| 2024 | 179 | 209 |
| 2025 | 143 | 175 |
| 2026 | 88 | 247 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Laser folded 3D electronics29 Sep 2026US 12,750,950 B2The United States of America as represented by the Secretary of the Army
- Printed circuit board and method of manufacturing the same22 Sep 2026US 12,745,342 B2Rolls-Royce Deutschland Ltd & Co KG
- Method of manufacturing transient electronics15 Sep 2026US 12,739,979 B2Accenture Global Solutions Limited
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Flexible circuit board and manufacturing method therefor8 Oct 2026US 2026/0313789 A1Pomiran Metalization Research Co., Ltd.
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Component Carrier and a Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304611 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component Carrier With at Least One Opening and Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304618 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
Most cited
By later US patents
- Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides552US 4,857,382 AGeneral Electric Company · 1989
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- Flexible circuits for electrosurgical instrument378US 10,555,769 B2Ethicon, Inc. · 2020
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000