H05K 3/0055
After-treatment
Official title: {After-treatment, e.g. cleaning or desmearing of holes}
H05K3/0055 (After-treatment) appears on 262 US grants and 231 published applications in this corpus.
Search patents in H05K- Granted patents
- 262
- Published applications
- 231
- Assignees
- 170
- Inventors
- 735
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 10 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 11 | 0 |
| 1990 | 8 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 8 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 3 |
| 2002 | 5 | 5 |
| 2003 | 5 | 11 |
| 2004 | 8 | 8 |
| 2005 | 3 | 4 |
| 2006 | 2 | 7 |
| 2007 | 2 | 4 |
| 2008 | 1 | 7 |
| 2009 | 2 | 13 |
| 2010 | 11 | 8 |
| 2011 | 4 | 9 |
| 2012 | 11 | 8 |
| 2013 | 5 | 7 |
| 2014 | 5 | 9 |
| 2015 | 4 | 4 |
| 2016 | 6 | 15 |
| 2017 | 7 | 16 |
| 2018 | 10 | 14 |
| 2019 | 14 | 14 |
| 2020 | 12 | 16 |
| 2021 | 16 | 10 |
| 2022 | 4 | 2 |
| 2023 | 3 | 4 |
| 2024 | 4 | 13 |
| 2025 | 5 | 10 |
| 2026 | 4 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of making an interconnect substrate14 Apr 2026US 12,604,395 B2Shinko Electric Industries Co., Ltd.
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Electrical module and printed circuit board assembly comprising an electrical module27 Jan 2026US 12,538,425 B2Rolls-Royce Deutschland Ltd & Co KG
- Method for manufacturing semi-flex printed circuit board27 Jan 2026US 12,538,430 B2Tripod (Wuxi) Electronic Co., Ltd.
- Printed wiring board and method for manufacturing printed wiring board25 Nov 2025US 12,484,155 B2KYOCERA Corporation
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Method for suctioning off particles, in particular when cutting individual printed circuit boards out of a circuit board panel, suction device, suction system and cutting machine20 Aug 2026US 2026/0241506 A1Schunk Electronic Solutions GmbH
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Precision alignment features for high density interconnects16 Jul 2026US 2026/0206605 A1Raytheon Company
- Wiring board stacked body and method of manufacturing wiring board stacked body2 Jul 2026US 2026/0190221 A1Daiwa Co., Ltd.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Laser beam scanning method for forming via holes in polymer materials168US 4,894,115 AGeneral Electric Company · 1990
- Printed wiring board having highly reliably via hole and process for forming via hole129US 6,280,641 B1Mitsubishi Gas Chemical Company, Inc. · 2001
- Method for producing via holes in polymer dielectrics127US 4,764,485 AGeneral Electric Company · 1988
- Method for forming through holes in a polyimide substrate65US 4,959,119 AE. I. Du Pont de Nemours and Company · 1990