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US 2026/0190221 A1Published application
Wiring board stacked body and method of manufacturing wiring board stacked body
AssigneeDaiwa Co., Ltd.
InventorEiji YOSHIMURA
Life of this patent
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Abstract
A wiring board stacked body includes: a wiring board WB having an opening; an embedded member embedded in an inside of the opening formed in the wiring board WB; a hardened material containing a thermosetting resin, disposed between the embedded member and an inner peripheral surface of the opening, and adhered to the wiring board WB; and a wiring layer formed on surfaces of the wiring board WB, the embedded member and the hardened material. The embedded member includes a ceramic body, and metal films each formed on both surfaces of the ceramic body.
Claims11
A wiring board stacked body comprising:
- a wiring board having an opening;
- an embedded member embedded in an inside of the opening formed in the wiring board;
- a hardened material containing a thermosetting resin, disposed between the embedded member and an inner peripheral surface of the opening, and adhered to the wiring board;
- and
- a wiring layer formed on surfaces of the wiring board, the embedded member and the thermosetting resin, wherein
- the embedded member includes a ceramic body, and metal films each formed on both surfaces of the ceramic body.
3 more elements
Dependencies are inferred from the claim text.