Printed wiring board and method for manufacturing printed wiring board
AssigneeKYOCERA Corporation
InventorKeisaku Matsumoto
Life of this patent
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Abstract
A printed wiring board includes an insulating layer and a conductor part. The insulating layer includes a cavity perpendicular to a first surface of the insulating layer. The conductor part includes a connection conductor fitted in at least part of the cavity. The cavity includes a first recess provided in an inner wall surface of the cavity. The connection conductor is partially fitted in the first recess. The first recess includes a second recess provided in an inner wall surface of the first recess. The connection conductor is partially fitted in the second recess.
Claims14
A printed wiring board comprising:
- an insulating layer including
- a first surface,
- an impregnating material made of an organic resin,
- a plurality of particles dispersed in the impregnating material, and
- a cavity perpendicular to the first surface, the cavity comprising a first recess in an inner wall surface of the cavity, the first recess comprising a second recess in an inner wall surface of the first recess;
- and
- a conductor part including a connection conductor fitted in at least part of the cavity, wherein the connection conductor is partially fitted in the first recess and partially fitted in the second recess and further includes a plurality of wedge-shaped projections that:
- (i) are integrally continuous with a portion of the connection conductor located in the first recess and or the second recess, and
- (ii) are disposed along a thickness direction of the insulating layer at intervals corresponding to two to three reinforcement-cloth layers.
A method for manufacturing a printed wiring board, the method comprising:
- forming a cavity perpendicular to a first surface of an insulating layer containing particles;
- removing a smear produced in the insulating layer in the cavity forming step by plasma treatment;
- forming a second recess in an inner wall surface of a first recess on a surface of an impregnating material in an inner wall surface of the cavity by ultrasonication after the plasma treatment in such a manner that the particles contained in the insulating layer and exposed to view at the inner wall surface of the cavity come off the insulating layer;
- and
- forming a connection conductor to be fitted in the first recess, the second recess, and at least part of the cavity,
- forming a plurality of wedge-shaped projections in the connection conductor, wherein plurality of wedge-shaped projections:
- (i) are integrally continuous with a portion of the connection conductor located in the first recess and/or the second recess, and
- (ii) are disposed along a thickness direction of the insulating layer at intervals corresponding to two to three reinforcement-cloth layers, and
- wherein the impregnating material is made of an organic resin and a plurality of particles are dispersed in the impregnating material.
Dependencies are inferred from the claim text.