H05K 3/0044
Mechanical working of the substrate
Official title: {Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence)}
H05K3/0044 (Mechanical working of the substrate) appears on 2,508 US grants and 2,479 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,508
- Published applications
- 2,479
- Assignees
- 1,123
- Inventors
- 5,502
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 10 | 0 |
| 1981 | 7 | 0 |
| 1982 | 9 | 0 |
| 1983 | 8 | 0 |
| 1984 | 10 | 0 |
| 1985 | 14 | 0 |
| 1986 | 17 | 0 |
| 1987 | 22 | 0 |
| 1988 | 19 | 0 |
| 1989 | 34 | 0 |
| 1990 | 30 | 0 |
| 1991 | 33 | 0 |
| 1992 | 34 | 0 |
| 1993 | 41 | 0 |
| 1994 | 30 | 0 |
| 1995 | 28 | 0 |
| 1996 | 31 | 0 |
| 1997 | 35 | 0 |
| 1998 | 43 | 0 |
| 1999 | 53 | 0 |
| 2000 | 53 | 0 |
| 2001 | 86 | 33 |
| 2002 | 65 | 107 |
| 2003 | 86 | 100 |
| 2004 | 88 | 106 |
| 2005 | 66 | 110 |
| 2006 | 71 | 131 |
| 2007 | 82 | 146 |
| 2008 | 80 | 141 |
| 2009 | 60 | 110 |
| 2010 | 80 | 108 |
| 2011 | 67 | 84 |
| 2012 | 90 | 62 |
| 2013 | 69 | 60 |
| 2014 | 49 | 89 |
| 2015 | 52 | 111 |
| 2016 | 75 | 91 |
| 2017 | 89 | 109 |
| 2018 | 108 | 104 |
| 2019 | 99 | 86 |
| 2020 | 110 | 116 |
| 2021 | 73 | 94 |
| 2022 | 79 | 70 |
| 2023 | 63 | 80 |
| 2024 | 55 | 77 |
| 2025 | 52 | 74 |
| 2026 | 36 | 80 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Printed circuit board and method of manufacturing the same22 Sep 2026US 12,745,342 B2Rolls-Royce Deutschland Ltd & Co KG
- Stretchable substrate, and method for manufacturing stretchable substrate8 Sep 2026US 12,733,091 B2Korea Photonics Technology Institute
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Circuit board manufacturing method18 Aug 2026US 12,713,537 B2Ufab Corporation
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Systems and methods for removing undesired metal within vias from printed circuit boards1 Oct 2026US 2026/0304635 A1TTM Technologies North America, LLC
- Substrate, package, gas sensor module, gas sensor, and method for manufacturing gas sensor24 Sep 2026US 2026/0287567 A1KYOCERA Corporation
- Metal card including insert coil and method of manufacturing same17 Sep 2026US 2026/0282209 A1Kona M Co., Ltd.
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
Most cited
By later US patents
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom286US 6,036,099 A2000
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Semiconductor package using terminals formed on a conductive layer of a circuit board258US 6,040,622 ASanDisk Corporation · 2000