H05K 3/0047
Drilling of holes
Official title: {Drilling of holes}
H05K3/0047 (Drilling of holes) appears on 677 US grants and 710 published applications in this corpus.
Search patents in H05K- Granted patents
- 677
- Published applications
- 710
- Assignees
- 384
- Inventors
- 1,610
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 6 | 0 |
| 1988 | 8 | 0 |
| 1989 | 8 | 0 |
| 1990 | 15 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 12 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 10 | 0 |
| 1997 | 6 | 0 |
| 1998 | 10 | 0 |
| 1999 | 12 | 0 |
| 2000 | 12 | 0 |
| 2001 | 21 | 11 |
| 2002 | 11 | 26 |
| 2003 | 15 | 16 |
| 2004 | 13 | 16 |
| 2005 | 10 | 17 |
| 2006 | 13 | 27 |
| 2007 | 14 | 32 |
| 2008 | 15 | 26 |
| 2009 | 11 | 15 |
| 2010 | 14 | 22 |
| 2011 | 9 | 11 |
| 2012 | 14 | 12 |
| 2013 | 8 | 14 |
| 2014 | 12 | 21 |
| 2015 | 7 | 35 |
| 2016 | 23 | 37 |
| 2017 | 38 | 35 |
| 2018 | 44 | 50 |
| 2019 | 31 | 31 |
| 2020 | 41 | 39 |
| 2021 | 33 | 43 |
| 2022 | 29 | 32 |
| 2023 | 25 | 37 |
| 2024 | 20 | 32 |
| 2025 | 29 | 32 |
| 2026 | 16 | 41 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Circuit board manufacturing method18 Aug 2026US 12,713,537 B2Ufab Corporation
- Real-time control of via stub drilling depth asymmetry28 Jul 2026US 12,696,396 B2International Business Machines Corporation
- Embedded passives with cavity sidewall interconnect in glass core architecture21 Jul 2026US 12,690,136 B2Intel Corporation
- Method for manufacturing a packaging substrate, and packaging substrate14 Jul 2026US 12,684,703 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Systems and methods for removing undesired metal within vias from printed circuit boards1 Oct 2026US 2026/0304635 A1TTM Technologies North America, LLC
- Metal card including insert coil and method of manufacturing same17 Sep 2026US 2026/0282209 A1Kona M Co., Ltd.
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
- Circuit board manufacturing system and method17 Sep 2026US 2026/0282242 A1Ufab Corporation
Most cited
By later US patents
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- Printed circuit board through hole technique143US 4,964,948 AProtoCAD, Inc. · 1990
- Backplane for radio frequency signals134US 6,392,160 B1Lucent Technologies Inc. · 2002
- Fine dimension stacked vias for a multiple layer circuit board structure119US 5,699,613 AInternational Business Machines Corporation · 1997
- High throughput hole forming system with multiple spindles per station116US 6,174,271 B1Electro Scientific Industries, Inc. · 2001