Printed circuit board and manufacturing method thereof

A method for manufacturing a printed circuit board, the method comprising:

• forming a plurality of layers arranged in layers with insulators therebetween;
• forming a via hole in a penetrating manner, including an n-th layer arranged on an uppermost side or a first layer arranged on a lowermost side in a laminating direction;
• forming a plating layer inside and outside the via hole;
• and
• forming a pad by separating a plating layer, exposed to outside, of the plating layer of the via hole from a peripheral area.

A method for manufacturing a printed circuit board, the method comprising:

• forming a first layer to an n-th layer, arranged in layers with insulators therebetween;
• laminating the first layer to the n-th layer such that the first layer is arranged on a lowermost side and the n-th layer is arranged on an uppermost side in a laminating direction;
• forming a via hole comprising a through-via hole penetrating from the n-th layer to the first layer;
• forming a plating layer inside and outside the via hole comprising the through-via hole;
• and
• forming a pad by separating a plating layer, exposed to outside, of the plating layer of the through-via hole from a peripheral area.