Method for manufacturing a packaging substrate, and packaging substrate

A method for manufacturing a packaging substrate, comprising:

• providing a bottom board, wherein the bottom board is provided with a first circuit layer, the first circuit layer is provided with at least a first demand point and a second demand point, and a first to-be-avoided region is provided between the first demand point and the second demand point;
• machining a first intermediate insulating layer on the bottom board, wherein the first intermediate insulating layer comprises a first intermediate insulating dielectric covering the first to-be-avoided region;
• machining a first intermediate wiring layer on the first intermediate insulating layer, wherein the first intermediate wiring layer comprises a first intermediate circuit partially arranged on the first intermediate insulating dielectric, and connecting the first demand point with the second demand point through the first intermediate circuit;
• stacking a first insulating layer on the bottom board to cover the first intermediate wiring layer, a lower surface of the first insulating layer being coplanar with the bottom board;
• and
• machining a circuit build-up layer on the first insulating layer.