Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process

A method of forming a lamination stack comprising:

• providing a core;
• applying a first graphene layer to a surface portion of the core;
• applying a metal layer to the first graphene layer;
• applying a second graphene layer to the metal layer;
• applying a photoresist layer to the second graphene layer;
• following application of the first graphene layer, the metal layer, the second graphene layer, and the photoresist layer, applying a protective layer to the photoresist layer;
• drilling through the protective layer and through at least one of the photoresist layer, the second graphene layer, the metal layer, the first graphene layer, or the core;
• applying a metallic plating to the lamination stack, wherein the metallic plating is applied to the lamination stack such that the metallic plating covers an internal surface of the lamination stack formed by the drilling;
• and
• removing the protective layer from the photoresist layer, wherein removing the protective layer causes a removal of the metallic plating in contact with the protective layer.