H05K 3/0052
Depaneling, i.e. dividing a panel into circuit boards
Official title: {Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards}
H05K3/0052 (Depaneling, i.e. dividing a panel into circuit boards) appears on 1,261 US grants and 1,254 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,261
- Published applications
- 1,254
- Assignees
- 627
- Inventors
- 2,826
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 8 | 0 |
| 1988 | 6 | 0 |
| 1989 | 9 | 0 |
| 1990 | 7 | 0 |
| 1991 | 14 | 0 |
| 1992 | 9 | 0 |
| 1993 | 13 | 0 |
| 1994 | 10 | 0 |
| 1995 | 13 | 0 |
| 1996 | 16 | 0 |
| 1997 | 21 | 0 |
| 1998 | 24 | 0 |
| 1999 | 26 | 0 |
| 2000 | 30 | 0 |
| 2001 | 55 | 19 |
| 2002 | 38 | 60 |
| 2003 | 53 | 65 |
| 2004 | 61 | 71 |
| 2005 | 42 | 73 |
| 2006 | 49 | 85 |
| 2007 | 57 | 89 |
| 2008 | 47 | 85 |
| 2009 | 42 | 81 |
| 2010 | 52 | 68 |
| 2011 | 47 | 65 |
| 2012 | 62 | 43 |
| 2013 | 51 | 34 |
| 2014 | 30 | 54 |
| 2015 | 40 | 57 |
| 2016 | 34 | 30 |
| 2017 | 37 | 34 |
| 2018 | 41 | 28 |
| 2019 | 37 | 28 |
| 2020 | 40 | 49 |
| 2021 | 20 | 30 |
| 2022 | 28 | 18 |
| 2023 | 20 | 22 |
| 2024 | 20 | 26 |
| 2025 | 11 | 15 |
| 2026 | 10 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Panel-molded electronic assemblies21 Apr 2026US 12,610,471 B2Vicor Corporation
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- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Method for suctioning off particles, in particular when cutting individual printed circuit boards out of a circuit board panel, suction device, suction system and cutting machine20 Aug 2026US 2026/0241506 A1Schunk Electronic Solutions GmbH
- Substrate processing method30 Jul 2026US 2026/0223295 A1Aqlaser Co.,Ltd
- Method for manufacturing wiring substrate, and wiring substrate2 Jul 2026US 2026/0190243 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Semiconductor package using terminals formed on a conductive layer of a circuit board258US 6,040,622 ASanDisk Corporation · 2000
- Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards178US 6,464,121 B2Xerox Corporation · 2002