Substrate processing method
AssigneeAqlaser Co.,Ltd
InventorJi Hoon CHOI
Life of this patent
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Abstract
Disclosed is a substrate processing method comprising a step of preparing a substrate having a first insulating layer on one surface thereof; a step of exposing one surface of the substrate by irradiating the first insulating layer with a first laser beam; a step of forming a plurality of holes passing through the substrate by irradiating a second laser beam onto one exposed surface of the substrate; a step of irradiating a third laser beam onto one surface of the substrate to be overlapped with the plurality of holes; and a step of cutting the substrate.
Claims20
A substrate processing method comprising:
- a step of preparing a substrate having a first insulating layer on one surface thereof;
- a step of exposing one surface of the substrate by irradiating the first insulating layer with a first laser beam;
- a step of forming a plurality of holes passing through the substrate by irradiating a second laser beam onto one exposed surface of the substrate;
- a step of irradiating a third laser beam onto one surface of the substrate to be overlapped with the plurality of holes;
- and
- a step of cutting the substrate.
A substrate processing method comprising:
- a step of preparing a substrate having a first film on one surface thereof;
- a step of exposing one surface of the substrate by removing a portion of the first film;
- a step of forming a plurality of holes passing through the substrate on one exposed surface of the substrate;
- a step of irradiating a third laser beam onto one surface of the substrate to be overlapped with the plurality of holes;
- and
- a step of cutting the substrate.
Dependencies are inferred from the claim text.