H05K 3/0014
Shaping of the substrate
Official title: {Shaping of the substrate, e.g. by moulding}
H05K3/0014 (Shaping of the substrate) appears on 660 US grants and 768 published applications in this corpus.
Search patents in H05K- Granted patents
- 660
- Published applications
- 768
- Assignees
- 444
- Inventors
- 1,825
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 9 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 10 | 0 |
| 1994 | 5 | 0 |
| 1995 | 16 | 0 |
| 1996 | 4 | 0 |
| 1997 | 7 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 2 |
| 2002 | 9 | 7 |
| 2003 | 1 | 2 |
| 2004 | 2 | 15 |
| 2005 | 6 | 11 |
| 2006 | 2 | 11 |
| 2007 | 5 | 12 |
| 2008 | 3 | 22 |
| 2009 | 8 | 21 |
| 2010 | 9 | 15 |
| 2011 | 9 | 15 |
| 2012 | 14 | 20 |
| 2013 | 12 | 20 |
| 2014 | 17 | 29 |
| 2015 | 17 | 41 |
| 2016 | 32 | 64 |
| 2017 | 35 | 49 |
| 2018 | 39 | 65 |
| 2019 | 63 | 60 |
| 2020 | 48 | 53 |
| 2021 | 44 | 45 |
| 2022 | 47 | 58 |
| 2023 | 35 | 37 |
| 2024 | 48 | 45 |
| 2025 | 38 | 32 |
| 2026 | 17 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing transient electronics15 Sep 2026US 12,739,979 B2Accenture Global Solutions Limited
- Electronics packaging for moving platforms8 Sep 2026US 12,733,099 B2Raytheon Company
- Electronic structure and a method of manufacturing such11 Aug 2026US 12,707,567 B1Tacto Tek Oy
- Circuit board and method for manufacturing the same21 Jul 2026US 12,690,140 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board and package substrate comprising same7 Jul 2026US 12,677,382 B2LG Innotek Co., Ltd.
- Circuit board and package substrate comprising same17 Sep 2026US 2026/0282243 A1LG Innotek Co., Ltd.
- Power electronics assembly3 Sep 2026US 2026/0261213 A1
- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
- Wiring board2 Jul 2026US 2026/0190220 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Method of forming a three-dimensional printed circuit assembly211US 5,264,061 AMotorola, Inc. · 1993
- Method of producing boards for printed wiring159US 5,449,480 AHitachi Chemical Company, Ltd. · 1995
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Appendage mountable electronic devices conformable to surfaces111US 9,554,484 B2The Board of Trustees of the University of Illinois · 2017