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US 12,733,099 B2Granted
Electronics packaging for moving platforms
AssigneeRaytheon Company
InventorsGary Willenbring, Jason Graham, Neal R. Whatcott, Jacob Modjeski
Life of this patent
Estimating the term…
Abstract
In accordance with at least one aspect of this disclosure, a system includes one or more electronics boards and one or more plates configured to interleave the one or more electronics boards in a stack along an axis. When in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of a moving platform. Each of the one or more plates includes an inner diameter and an outer diameter, where the outer surface has an outer circumference at the outer diameter.
Claims20
A system, comprising:
- one or more electronics boards;
- and
- one or more plates configured to interleave the one or more electronics boards in a stack along an axis, each plate including a face configured to seat against a majority of a face of one of the one or more electronic boards;
- wherein, in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of an exterior surface of a moving platform, and
- wherein the outer surface has an outer circumference at an outer diameter of each of the one or more plates.
2 more elements
A system, comprising:
- multiple electronics boards;
- and
- multiple plates configured to interleave the electronics boards in a stack along an axis, each plate including a face configured to seat against a majority of a face of one of the multiple electronic boards;
- wherein, in the stack, outer surfaces of the plates form an outer mold line of a portion of an exterior surface of a movable platform;
- and
- wherein the outer surface has an outer circumference at an outer diameter of each of the one or more plates.
3 more elements
Dependencies are inferred from the claim text.