Method of manufacturing transient electronics

Abstract

The present disclosure relates to electronic devices and methods of manufacturing electronic devices. A method of manufacturing a dissolvable electronic device includes forming a dissolvable sheet; applying a self-sintering agent to the dissolvable sheet to form a substrate; and depositing electrically conductive ink onto the substrate in a trace. A method of manufacturing a meltable electronic device includes mixing a conductive material with a melted wax to form a conductive wax mixture in liquid form; molding the conductive wax mixture; and solidifying the conductive wax mixture to obtain the meltable electronic device. A method of manufacturing an edible electronic device includes cutting a layer of conductive material to form a pattern that defines a circuit; applying the layer of conductive material to an edible medium, wherein the edible medium is in liquid or semi-solid form; and solidifying the edible medium to obtain the edible electronic device.

Dependencies are inferred from the claim text.