H05K 3/0017
Etching of the substrate by chemical or physical means
Official title: {Etching of the substrate by chemical or physical means}
H05K3/0017 (Etching of the substrate by chemical or physical means) appears on 2,844 US grants and 2,801 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,844
- Published applications
- 2,801
- Assignees
- 889
- Inventors
- 5,736
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 5 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 6 | 0 |
| 1984 | 12 | 0 |
| 1985 | 16 | 0 |
| 1986 | 18 | 0 |
| 1987 | 20 | 0 |
| 1988 | 16 | 0 |
| 1989 | 28 | 0 |
| 1990 | 44 | 0 |
| 1991 | 38 | 0 |
| 1992 | 40 | 0 |
| 1993 | 45 | 0 |
| 1994 | 57 | 0 |
| 1995 | 40 | 0 |
| 1996 | 47 | 0 |
| 1997 | 55 | 0 |
| 1998 | 62 | 0 |
| 1999 | 66 | 0 |
| 2000 | 73 | 0 |
| 2001 | 90 | 52 |
| 2002 | 88 | 119 |
| 2003 | 116 | 117 |
| 2004 | 128 | 139 |
| 2005 | 72 | 134 |
| 2006 | 74 | 135 |
| 2007 | 64 | 125 |
| 2008 | 63 | 116 |
| 2009 | 54 | 122 |
| 2010 | 80 | 107 |
| 2011 | 78 | 98 |
| 2012 | 103 | 79 |
| 2013 | 70 | 63 |
| 2014 | 65 | 91 |
| 2015 | 74 | 120 |
| 2016 | 86 | 103 |
| 2017 | 85 | 135 |
| 2018 | 105 | 112 |
| 2019 | 118 | 106 |
| 2020 | 101 | 114 |
| 2021 | 89 | 104 |
| 2022 | 78 | 102 |
| 2023 | 80 | 93 |
| 2024 | 74 | 94 |
| 2025 | 59 | 68 |
| 2026 | 32 | 153 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Laser folded 3D electronics29 Sep 2026US 12,750,950 B2The United States of America as represented by the Secretary of the Army
- Method of producing printed circuit boards and printed circuit boards produced in accordance with the method8 Sep 2026US 12,733,108 B2Gebr. Schmid GmbH & Co.
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Circuit board assembly and method of manufacturing the same, packaging structure having the same1 Sep 2026US 12,727,091 B2Avary Holding (Shenzhen) Co., Limited.
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Component Carrier With at Least One Opening and Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304618 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board24 Sep 2026US 2026/0292972 A1Jsr Corporation
- Interconnect substrate and method of making same17 Sep 2026US 2026/0282212 A1Shinko Electric Industries Co., Ltd.
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
Most cited
By later US patents
- Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides552US 4,857,382 AGeneral Electric Company · 1989
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Formulation of multichip modules293US 5,239,448 AInternational Business Machines Corporation · 1993
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992