H05K 3/0026
By laser ablation
Official title: {by laser ablation}
H05K3/0026 (By laser ablation) appears on 1,633 US grants and 1,789 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,633
- Published applications
- 1,789
- Assignees
- 604
- Inventors
- 3,494
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 6 | 0 |
| 1989 | 4 | 0 |
| 1990 | 12 | 0 |
| 1991 | 14 | 0 |
| 1992 | 14 | 0 |
| 1993 | 16 | 0 |
| 1994 | 18 | 0 |
| 1995 | 13 | 0 |
| 1996 | 15 | 0 |
| 1997 | 28 | 0 |
| 1998 | 24 | 0 |
| 1999 | 26 | 0 |
| 2000 | 38 | 0 |
| 2001 | 47 | 31 |
| 2002 | 54 | 81 |
| 2003 | 73 | 84 |
| 2004 | 87 | 83 |
| 2005 | 45 | 81 |
| 2006 | 47 | 83 |
| 2007 | 41 | 70 |
| 2008 | 31 | 77 |
| 2009 | 35 | 86 |
| 2010 | 55 | 77 |
| 2011 | 51 | 75 |
| 2012 | 68 | 67 |
| 2013 | 57 | 40 |
| 2014 | 47 | 64 |
| 2015 | 50 | 74 |
| 2016 | 53 | 52 |
| 2017 | 49 | 84 |
| 2018 | 63 | 82 |
| 2019 | 73 | 71 |
| 2020 | 69 | 78 |
| 2021 | 64 | 68 |
| 2022 | 53 | 65 |
| 2023 | 56 | 67 |
| 2024 | 53 | 56 |
| 2025 | 37 | 45 |
| 2026 | 21 | 48 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Laser folded 3D electronics29 Sep 2026US 12,750,950 B2The United States of America as represented by the Secretary of the Army
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Method for manufacturing a printed circuit board with an embedded shield21 Jul 2026US 12,690,139 B2
- Method for manufacturing wiring board14 Jul 2026US 12,685,183 B2Toppan Inc.
- Component Carrier With at Least One Opening and Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304618 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Interconnect substrate and method of making same17 Sep 2026US 2026/0282212 A1Shinko Electric Industries Co., Ltd.
- Glass-based substrates including compressive layers, microelectronic articles including same, and methods of making same17 Sep 2026US 2026/0282213 A1Corning Incorporated
- Package substrate and fabricating method thereof13 Aug 2026US 2026/0239533 A1AaltoSemi Inc.
Most cited
By later US patents
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Laser system and method for single press micromachining of multilayer workpieces267US 6,407,363 B2Electro Scientific Industries, Inc. · 2002