H05K 3/0032
Of organic insulating material
Official title: {of organic insulating material}
H05K3/0032 (Of organic insulating material) appears on 1,155 US grants and 1,228 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,155
- Published applications
- 1,228
- Assignees
- 432
- Inventors
- 2,468
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 4 | 0 |
| 1990 | 8 | 0 |
| 1991 | 14 | 0 |
| 1992 | 11 | 0 |
| 1993 | 14 | 0 |
| 1994 | 14 | 0 |
| 1995 | 12 | 0 |
| 1996 | 14 | 0 |
| 1997 | 22 | 0 |
| 1998 | 21 | 0 |
| 1999 | 17 | 0 |
| 2000 | 32 | 0 |
| 2001 | 33 | 25 |
| 2002 | 42 | 66 |
| 2003 | 60 | 60 |
| 2004 | 68 | 60 |
| 2005 | 33 | 51 |
| 2006 | 36 | 57 |
| 2007 | 31 | 57 |
| 2008 | 22 | 63 |
| 2009 | 24 | 78 |
| 2010 | 47 | 67 |
| 2011 | 41 | 67 |
| 2012 | 58 | 60 |
| 2013 | 51 | 31 |
| 2014 | 36 | 44 |
| 2015 | 37 | 50 |
| 2016 | 40 | 27 |
| 2017 | 28 | 42 |
| 2018 | 25 | 43 |
| 2019 | 40 | 37 |
| 2020 | 41 | 39 |
| 2021 | 37 | 42 |
| 2022 | 23 | 43 |
| 2023 | 30 | 41 |
| 2024 | 34 | 35 |
| 2025 | 25 | 20 |
| 2026 | 12 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Printed wiring board16 Jun 2026US 12,660,085 B2Ibiden Co., Ltd.
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Laser processing method and circuit board manufacturing method19 May 2026US 12,635,083 B2Gigaphoton Inc.
- Package substrate and fabricating method thereof13 Aug 2026US 2026/0239533 A1AaltoSemi Inc.
- Wiring substrate and method for manufacturing the same6 Aug 2026US 2026/0231331 A1Ibiden Co., Ltd.
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Pcb via design for power electronic applications and method for manufacturing30 Jul 2026US 2026/0223282 A1Mitsubishi Electric Corporation
- Substrate processing method30 Jul 2026US 2026/0223295 A1Aqlaser Co.,Ltd
Most cited
By later US patents
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Laser system and method for single press micromachining of multilayer workpieces267US 6,407,363 B2Electro Scientific Industries, Inc. · 2002