H05K 3/0035
Of blind holes, i.e. having a metal layer at the bottom
Official title: {of blind holes, i.e. having a metal layer at the bottom}
H05K3/0035 (Of blind holes, i.e. having a metal layer at the bottom) appears on 610 US grants and 633 published applications in this corpus.
Search patents in H05K- Granted patents
- 610
- Published applications
- 633
- Assignees
- 243
- Inventors
- 1,367
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 9 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 12 | 0 |
| 1999 | 11 | 0 |
| 2000 | 17 | 0 |
| 2001 | 16 | 12 |
| 2002 | 24 | 33 |
| 2003 | 36 | 36 |
| 2004 | 29 | 24 |
| 2005 | 14 | 20 |
| 2006 | 19 | 32 |
| 2007 | 16 | 30 |
| 2008 | 17 | 38 |
| 2009 | 15 | 46 |
| 2010 | 30 | 30 |
| 2011 | 22 | 40 |
| 2012 | 36 | 31 |
| 2013 | 32 | 16 |
| 2014 | 19 | 21 |
| 2015 | 18 | 21 |
| 2016 | 19 | 15 |
| 2017 | 17 | 27 |
| 2018 | 13 | 18 |
| 2019 | 18 | 14 |
| 2020 | 18 | 17 |
| 2021 | 19 | 19 |
| 2022 | 11 | 21 |
| 2023 | 14 | 20 |
| 2024 | 17 | 23 |
| 2025 | 12 | 12 |
| 2026 | 9 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Semiconductor package including top-surface terminals for mounting another semiconductor package212US 7,671,457 B1Amkor Technology, Inc. · 2010
- Integrated circuit substrate having laser-embedded conductive patterns and method therefor204US 6,930,256 B1Amkor Technology, Inc. · 2005