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US 2026/0197940 A1Published application
Wiring board and wiring board manufacturing method
AssigneeShinko Electric Industries Co., Ltd.
InventorYusuke Ono
Life of this patent
Estimating the term…
Abstract
A wiring board includes a wiring layer, an insulating layer, and an opening. The insulating layer is laminated on the wiring layer. The opening penetrates through the insulating layer to the wiring layer. A surface of the wiring layer includes a roughened portion that is formed in a region except for a region overlapping with a periphery of a bottom surface of the opening, and a roughness reduced portion that is formed in the region overlapping with the periphery of the bottom surface of the opening and that has lower surface roughness than the roughened portion.
Claims7
A wiring board comprising:
- a wiring layer;
- an insulating layer that is laminated on the wiring layer;
- and
- an opening that penetrates through the insulating layer to the wiring layer, wherein
- a surface of the wiring layer includes
- a roughened portion that is formed in another region except for a region overlapping with a periphery of a bottom surface of the opening;
- and
- a roughness reduced portion that is formed in the region overlapping with the periphery of the bottom surface of the opening and that has lower surface roughness than the roughened portion.
5 more elements
Dependencies are inferred from the claim text.