H05K 3/0038
Combined with laser drilling through a metal layer
Official title: {combined with laser drilling through a metal layer}
H05K3/0038 (Combined with laser drilling through a metal layer) appears on 260 US grants and 284 published applications in this corpus.
Search patents in H05K- Granted patents
- 260
- Published applications
- 284
- Assignees
- 131
- Inventors
- 572
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 9 | 0 |
| 2001 | 6 | 6 |
| 2002 | 8 | 13 |
| 2003 | 12 | 9 |
| 2004 | 18 | 15 |
| 2005 | 5 | 13 |
| 2006 | 9 | 13 |
| 2007 | 6 | 9 |
| 2008 | 3 | 13 |
| 2009 | 8 | 18 |
| 2010 | 10 | 17 |
| 2011 | 10 | 14 |
| 2012 | 11 | 17 |
| 2013 | 12 | 5 |
| 2014 | 12 | 10 |
| 2015 | 12 | 9 |
| 2016 | 6 | 7 |
| 2017 | 7 | 9 |
| 2018 | 6 | 14 |
| 2019 | 12 | 9 |
| 2020 | 9 | 14 |
| 2021 | 19 | 15 |
| 2022 | 7 | 12 |
| 2023 | 10 | 12 |
| 2024 | 7 | 7 |
| 2025 | 7 | 1 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Laser system and method for single press micromachining of multilayer workpieces267US 6,407,363 B2Electro Scientific Industries, Inc. · 2002
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets146US 5,841,099 AElectro Scientific Industries, Inc. · 1998
- Semiconductor flip chip package145US 6,018,196 AW. L. Gore & Associates, Inc. · 2000
- High speed, high accuracy multi-stage tool positioning system143US 5,751,585 AElectro Scientific Industries, Inc. · 1998