Power conversion apparatus, system card, manufacturing method for an integrated capacitor substrate and power supply module

A power conversion apparatus, comprising:

• an input positive terminal, an input negative terminal, an output positive terminal, an output negative terminal, a high-voltage switch, a low-voltage switch, and a magnetic assembly,
• wherein the magnetic assembly comprises two magnetic cores, a high-voltage winding and a low-voltage winding;
• the high-voltage switch is electrically connected to the high-voltage winding, and the low-voltage switch is electrically connected to the low-voltage winding;
• the two magnetic cores are respectively a first magnetic core and a second magnetic core;
• each magnetic core comprise an upper magnetic cover, a lower magnetic cover, a first side column, a middle column, and a second side column;
• the first side column, the middle column, and the second side column are sequentially arranged in the same direction;
• the first side column, the middle column, and the second side column are all arranged between the upper magnetic cover and the lower magnetic cover;
• in the same magnetic core, a first winding channel is between the first side column and the middle column, and a second winding channel is between the second side column and the middle column;
• the first magnetic core and the second magnetic core are arranged adjacent to each other, the two first winding channels are arranged in a penetrating manner in a horizontal direction, and the two second winding channels are arranged in a penetrating manner in the horizontal direction;
• the high winding wound the middle columns of the two magnetic cores;
• the low-voltage winding penetrates the first winding channel or the second winding channel.

A manufacturing method for an integrated capacitor substrate, the integrated capacitor substrate comprising a capacitor and a double-sided board, wherein the capacitor is connected with two pads;

• the manufacturing method comprising:
• step 1:
• embedding the capacitor in the double-sided substrate, and drawing pad pins of the capacitor by means of laser drilling;
• step 2:
• respectively laminating an insulating layer and a layer of copper foil on a top surface and a bottom surface of the double-sided board with the embedded capacitor, thereby forming at least four layers of the substrate;
• step 3:
• for the at least four-layer substrate, a via is provided in a region where the capacitor is not embedded;
• in a region where the capacitor is embedded, a laser hole is drilled at a position corresponding to the pads lead-out position;
• the capacitor is disposed adjacent to the via;
• step 4:
• a BGA pin is formed in a position of the via in the at least four-layer substrate and the position of the laser hole.

A power supply module, comprising:

• a circuit substrate, a voltage regulator array and a plurality of power conversion apparatuses,
• wherein the circuit substrate comprises a top surface and a bottom surface opposite to each other;
• the voltage regulator array and the power conversion apparatuses are disposed on the bottom surface of the circuit substrate;
• the power conversion apparatuses are electronically connected with the voltage regulator array, and supply power to the voltage regulator array;
• the voltage regulator array supplies power to a load chip;
• the projections of the load chip and the voltage regulator array on the bottom surface of the circuit substrate are at least partially overlapped;
• the plurality of the power conversion apparatuses are disposed on the two opposite sides of the voltage regulator array, respectively.