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US 12,690,139 B2Granted
Method for manufacturing a printed circuit board with an embedded shield
OwnerKuo-Hao Pao, Yu-Cheng Lininventors
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Abstract
This invention introduces an advanced method for manufacturing printed circuit boards (PCBs) featuring an embedded shield, enhancing the integrity and functionality of electronic devices. The process involves forming trenches on the PCB, filling them with solder paste, and seamlessly integrating a shield with a frame through a meticulous soldering procedure. This refined technique offers superior reliability and paves the way for more intricate and robust electronic designs.
Claims12
A method for manufacturing a printed circuit board (PCB) with an embedded shield, comprising:
- providing a PCB;
- forming at least one trench at the PCB;
- electroplating the trench with a metal layer to form an electroplated trench;
- filling a solder paste in the electroplated trench;
- disposing a shield with at least one frame at the PCB;
- and
- soldering the PCB with the shield;
- wherein the frame of the shield is disposed in the electroplated trench, and a portion of the frame is immersed in the solder paste, such that the frame of the shield is seamlessly integrated with the metal layer.
5 more elements
A PCB with an embedded shield, comprising:
- a PCB having at least one trench formed thereon, the trench being electroplated with a metal layer;
- a shield with at least one frame, wherein the shield is disposed at and soldered to the PCB;
- and
- a solder paste filled in the electroplated trench;
- wherein the frame of the shield is disposed in the electroplated trench, and a portion of the frame is immersed in the solder paste, such that the frame of the shield is seamlessly integrated with the metal layer.
2 more elements
Dependencies are inferred from the claim text.