H05K 3/0029
Of inorganic insulating material
Official title: {of inorganic insulating material}
H05K3/0029 (Of inorganic insulating material) appears on 189 US grants and 220 published applications in this corpus.
Search patents in H05K- Granted patents
- 189
- Published applications
- 220
- Assignees
- 123
- Inventors
- 555
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 9 | 2 |
| 2002 | 6 | 2 |
| 2003 | 2 | 6 |
| 2004 | 5 | 8 |
| 2005 | 6 | 9 |
| 2006 | 3 | 4 |
| 2007 | 3 | 3 |
| 2008 | 1 | 5 |
| 2009 | 4 | 5 |
| 2010 | 3 | 8 |
| 2011 | 3 | 2 |
| 2012 | 2 | 3 |
| 2013 | 5 | 9 |
| 2014 | 2 | 8 |
| 2015 | 8 | 12 |
| 2016 | 6 | 8 |
| 2017 | 6 | 9 |
| 2018 | 8 | 13 |
| 2019 | 9 | 10 |
| 2020 | 6 | 21 |
| 2021 | 10 | 13 |
| 2022 | 15 | 12 |
| 2023 | 11 | 11 |
| 2024 | 8 | 7 |
| 2025 | 4 | 14 |
| 2026 | 3 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for making a recess or opening into a planar workpiece using successive etching14 Apr 2026US 12,604,743 B2Lpkf Laser & Electronics AG
- Package having thick glass core with high aspect ratio vias17 Feb 2026US 12,557,211 B2Intel Corporation
- Electronic device and method of manufacturing electronic device3 Feb 2026US 12,542,341 B2Innolux Corporation
- Method of processing substrate16 Dec 2025US 12,501,552 B2Via Mechanics, Ltd.
- Three-dimensional circuit board, manufacturing method thereof, and probe card12 Aug 2025US 12,389,535 B2Industrial Technology Research Institute
- Interconnect substrate and method of making same17 Sep 2026US 2026/0282212 A1Shinko Electric Industries Co., Ltd.
- Manufacturing method of electronic device6 Aug 2026US 2026/0231780 A1Innolux Corporation
- Substrate processing method30 Jul 2026US 2026/0223295 A1Aqlaser Co.,Ltd
- Metallized ceramic circuit board and manufacturing method thereof23 Jul 2026US 2026/0214794 A1Tong Hsing Electronic Industries, Ltd.
- Glass core laminate, method for manufacturing glass core laminate, and method for cutting glass core laminate2 Jul 2026US 2026/0190222 A1Joongwoo M-Tech Co., Ltd.
Most cited
By later US patents
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate256US 6,107,109 AMicron Technology, Inc. · 2000
- Semiconductor interconnect having laser machined contacts223US 6,294,837 B1Micron Technology, Inc. · 2001
- Process for producing electrical connections through a substrate191US 4,964,212 ACommissariat A L' Energie Atomique · 1990
- Method for fabricating semiconductor components and interconnects with contacts on opposing sides179US 6,620,731 B1Micron Technology, Inc. · 2003